VIAVI Solutions will showcase a range of validation technologies for next-generation AI fabrics and high-speed optical interconnects at OFC 2026 in Los Angeles, highlighting the growing complexity of testing large-scale AI infrastructure. The company plans demonstrations covering 1.6T Ethernet, silicon photonics manufacturing, PCIe over optics, automated network testing, and fiber sensing. The demonstrations will run at booth 1239 from March 17–19 at the Los Angeles Convention Center.
The exhibit centers on validation tools designed for tightly coupled AI systems where performance, latency, and reliability requirements exceed those of traditional networks. VIAVI will demonstrate its ONE LabPro and TestCenter platforms, which provide OSI Layer 0–3 traffic generation and analysis. The company will also present new capabilities for validating emerging optical technologies, including a hollow-core fiber test solution and the DCX-700 optical loss test set capable of testing up to 24 fibers simultaneously.
VIAVI will introduce three new technologies at the event, including probe microscopes designed for hyperscale data center inspection, a high-density OSFP test platform for 1.6T Ethernet validation, and a distributed acoustic sensing system with embedded AI and machine learning for real-time analysis. Several demonstrations will be conducted in collaboration with industry partners and organizations including the Ethernet Alliance and Fiber Optic Center, with interoperability demonstrations involving companies such as Amphenol and Celestica.
• Demonstrations focused on validation of AI-scale networking infrastructure and optical interconnects
• 1.6T Ethernet and OSFP validation tools targeting hyperscale and AI cluster environments
• Silicon photonics manufacturing test capabilities for next-generation optical modules
• PCIe over optics validation to support disaggregated AI system architectures
• Hollow-core fiber test solution and DCX-700 platform supporting multi-fiber loss testing
• Distributed acoustic sensing system with real-time edge AI and machine learning
• INX 700 probe microscopes designed for automated inspection of single-fiber and multifiber connectors in hyperscale data centers
• Collaboration with the Ethernet Alliance and Fiber Optic Center on interoperability demonstrations
“Today, the industry requires a comprehensive and AI fabric-aware view of the network.”
🌐 Analysis
The rise of large AI training clusters and disaggregated accelerator fabrics is driving demand for validation tools that can emulate complex traffic patterns across Ethernet, PCIe, and optical layers simultaneously. Vendors across the ecosystem—including optical module suppliers, switch silicon providers, and hyperscale infrastructure operators—are increasing investment in high-speed validation platforms as the industry moves toward 1.6T optics, co-packaged optics, and next-generation AI fabrics.
