Apple expanded its semiconductor partnership with Broadcom through a new multiyear agreement expected to exceed $30 billion, covering the design and production of custom silicon components and wireless connectivity technologies for Apple products. The companies expect the agreement to result in production of more than 15 billion U.S.-made chips and support hundreds of American jobs.
The agreement will support a $1.5 billion expansion and modernization of Broadcom’s manufacturing facilities in Fort Collins, Colorado. Broadcom will produce advanced radio frequency components, including film bulk acoustic resonator (FBAR) filters, as well as wireless connectivity technologies at the site. Apple described the agreement as its largest commitment to date under the American Manufacturing Program, which the company launched in 2025 to accelerate domestic manufacturing.
Apple said the agreement forms part of its commitment to invest $600 billion in the U.S. economy over four years. The expanded Broadcom relationship adds to Apple’s efforts to develop a domestic semiconductor supply chain spanning chip design, manufacturing, packaging, and component production.
• Agreement value: More than $30 billion over multiple years
• Production target: More than 15 billion U.S.-made chips
• Broadcom investment: $1.5 billion to expand and modernize its Fort Collins manufacturing facilities
• Key technology: Advanced RF components, including FBAR filters, and wireless connectivity technologies
• Manufacturing location: Fort Collins, Colorado
• Employment impact: Hundreds of U.S. jobs supported
• Apple program: Largest commitment announced under the American Manufacturing Program
• Broader investment plan: Apple plans to invest $600 billion in the U.S. economy over four years
“Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation,” said Tim Cook, Apple’s CEO. “The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect, and we’re proud to deepen our investments in U.S.-based suppliers that share our commitment to excellence and innovation.”
🌐 Analysis: The agreement strengthens Broadcom’s position as a strategic supplier of RF and wireless connectivity components for Apple while directing additional capital toward U.S.-based semiconductor manufacturing. Apple’s commitment also illustrates how major systems companies increasingly use long-term supply agreements and direct supplier investments to secure capacity for specialized chips and components that remain critical to high-volume consumer electronics.
The Fort Collins expansion is significant because RF filters and related front-end components require specialized materials, manufacturing processes, and intellectual property distinct from leading-edge logic fabrication. The agreement therefore broadens the scope of U.S. semiconductor investment beyond advanced CPU and AI accelerator manufacturing to include connectivity components that play a critical role in smartphones, tablets, computers, and other wireless devices.
Deep Dive: Broadcom’s Fort Collins Semiconductor Facility Facility Scale, Technology and Manufacturing Capabilities • Updated July 8, 2026 | |
| Campus Scale | Approximately 1.4 million sq. ft. (130,000 m²) of facility space in Fort Collins, Colorado. |
| Cleanroom Capacity | Approximately 185,000 sq. ft. (17,200 m²) of cleanroom space supporting semiconductor wafer fabrication and related manufacturing processes. |
| Facility Type | An internal Broadcom semiconductor wafer fabrication, process-development and R&D operation with a manufacturing lineage extending back to Hewlett-Packard’s semiconductor business. |
| Core Technology | Film Bulk Acoustic Resonator (FBAR) technology used to manufacture high-performance RF filters and related wireless front-end components. |
| What FBAR Does | Acoustic resonators provide highly selective RF filtering in compact semiconductor packages, helping mobile devices isolate frequency bands and operate across increasingly crowded cellular spectrum allocations. |
| Manufacturing Capabilities | Wafer Fabrication Thin-Film Processing Photolithography Acoustic Devices RF Components |
| Process Specialization | The fab specializes in specialty semiconductor processes rather than leading-edge digital logic nodes, reflecting the distinct materials, device structures and manufacturing requirements of RF acoustic components. |
| Lithography Infrastructure | Facility expansions have included specialized fab space engineered for heavy, vibration-sensitive semiconductor manufacturing and lithography equipment, including the B4 West Annex. |
| Wireless Applications | RF filters and wireless connectivity components produced using the site’s technology support smartphones and other connected devices operating across multiple cellular frequency bands and regional network configurations. |
| Technology Heritage | HP Semiconductor → Agilent → Avago Technologies → Broadcom |
| Environmental Performance | The facility reported a 68% reduction in Scope 1 and Scope 2 greenhouse gas emissions since 2015 through emissions-abatement, energy-efficiency and facility-improvement programs. |
| Why It Matters | Fort Collins is a significant U.S.-based specialty semiconductor manufacturing asset focused on RF and acoustic-filter technologies that complement the leading-edge logic fabs receiving most current semiconductor investment attention. |
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