The Ethernet Alliance’s Technology Exploration Forum (TEF25) brought together industry leaders, standards-setters, researchers, and hyperscaler architects for a full day of deep technical discussion in Mountain View, California. Across AI fabrics, high-speed optics, channel modeling, interoperability, and next-generation Ethernet signaling, the event captured a turning point for the ecosystem: Ethernet is evolving from a connectivity workhorse into the foundational fabric for global AI infrastructure.
A recurring theme throughout the sessions was the rapid convergence of optical, electrical, mechanical, and software domains, all driven by unprecedented scale requirements from AI clusters. Presenters emphasized power efficiency, manufacturability, interoperability, and predictable latencies as the defining constraints shaping future developments at 200G/lane, 800G, 1.6T, and toward 3.2T Ethernet. Standards bodies—including IEEE, OIF, and the Ethernet Alliance—highlighted the need for tighter collaboration as roadmaps accelerate.
Ashika Pandankeril Shaji on Advancing 400G Channels for AI Fabrics
Presenter: Ashika Pandankeril Shaji, TE Connectivity
Description: Ashika explains how shrinking channel budgets, higher noise sensitivity, and rising AI-fabric demands are reshaping 400G electrical interfaces. She highlights system-level challenges and the collaborative development TE Connectivity is driving across the ecosystem.
Shortlink: https://ngi.fyi/tef25-te-ashika2
2. Halil Cirit on How Hyperscalers Shape Ethernet Requirements
Presenter: Halil Cirit, Meta
Description: Halil describes hyperscalers’ role as both end users and technology drivers, detailing how their architectures influence optical module design, electrical signaling roadmaps, and system reliability expectations at massive AI scale.
Shortlink: https://ngi.fyi/tef25-meta-halil2
3. John D’Ambrosia on Cross-Industry Coordination for Next-Gen Ethernet
Presenter: John D’Ambrosia
Description: John discusses how IEEE and industry groups can accelerate future 1.6T/3.2T Ethernet programs through shared modeling, testing, and ecosystem alignment.
Shortlink: https://ngi.fyi/tef25-ea-john2
4. Peter Jones on the Ethernet Alliance’s Mission in the AI Era
Presenter: Peter Jones, Chair, Ethernet Alliance / Cisco Systems
Description: Peter outlines how the Ethernet Alliance works to align suppliers, standards groups, and end users, ensuring Ethernet continues meeting the explosive demands of AI networks.
Shortlink: https://ngi.fyi/ef25-ethernetalliance-peter2
5. David Rodgers on Testing, Reliability, and Field-Proven Ethernet
Presenter: David Rodgers, Ethernet Alliance / EXFO
Description: David explains why robust testing frameworks, measurement methodologies, and field validation matter more than ever as Ethernet link budgets tighten across next-gen deployments.
Shortlink: https://ngi.fyi/ethernetalliance-david2
6. John D’Ambrosia on IEEE P802.3dj and the Future of Ethernet Signaling
Presenter: John D’Ambrosia, IEEE P802.3dj Task Force
Description: John walks through the 200G/lane electrical objectives of IEEE P802.3dj and how the standard positions Ethernet for future 1.6T/3.2T ecosystems.
Shortlink: https://ngi.fyi/ef25-ieee-john2
7. Baron Fung on AI Infrastructure Market Transitions
Presenter: Baron Fung, Dell’Oro Group
Description: Baron examines trends in AI hardware spending, interconnect adoption, and the shifting balance between Ethernet and proprietary scale-up fabrics.
Shortlink: https://ngi.fyi/tef25-delloro-baron
8. Alan Weckel on Ethernet’s Role in Hyperscale Expansion
Presenter: Alan Weckel, 650 Group
Description: Alan presents updated market trajectories for 800G, 1.6T, and AI-cluster networking, noting how cloud operators are influencing Ethernet component economics.
Shortlink: https://ngi.fyi/tef25-650-alan2
9. Hani Daou on High-Speed Test & Measurement for 224G/448G
Presenter: Hani Daou, Multilane
Description: Hani discusses evolving test requirements for next-generation SerDes and optical modules, including PAM4 signal integrity and hyperscaler readiness.
Shortlink: https://ngi.fyi/tef25-multilane-hani
10. Hadrien Louchet on Power and Efficiency Constraints for AI Networking
Presenter: Hadrien Louchet, Keysight Technologies
Description: Hadrien explains how rising power density and thermal constraints are shaping the design of high-speed interconnects across data centers.
Shortlink: https://ngi.fyi/tef25-keysight-harden
11. John Calvin on Channel Modeling for Multi-Tbps Ethernet
Presenter: John Calvin, Keysight Technologies
Description: John outlines advanced modeling techniques that help vendors evaluate electrical channels as signaling speeds double.
Shortlink: https://ngi.fyi/tef25-keysight-john
12. David B. Kiddoo on Cabling Trends for High-Density AI Deployments
Presenter: David B. Kiddoo, CCCA & IWCS
Description: David highlights how cabling infrastructure must evolve to support high-power, high-bandwidth clusters while maintaining safety and manageability.
Shortlink: https://ngi.fyi/tef25-cccaiwcs-dk
13. Pete Del Vecchio on Broadcom’s Perspective on Next-Gen PHYs
Presenter: Pete Del Vecchio, Broadcom
Description: Pete discusses PHY evolution, electrical signaling constraints, and the architectural pressures created by massive AI scale-out.
Shortlink: https://ngi.fyi/tef25-broadcom-p
14. Ravi Shah on AI Fabric Strategies at Cisco
Presenter: Ravi Shah, Cisco Systems
Description: Ravi describes how Cisco is designing Ethernet to meet AI cluster performance requirements, including congestion management and deterministic latency.
Shortlink: https://ngi.fyi/tef25-cisco-ravi
15. Kent Lusted on Synopsys’ View of Interface IP at 224G+
Presenter: Kent Lusted, Synopsys
Description: Kent explains the challenges of designing PHY IP at 224G and the co-optimization required between SerDes, packaging, and system architectures.
Shortlink: https://ngi.fyi/tef25-synopsys-kent
16. Arihant Jain on Scaling AI Clusters with Ethernet
Presenter: Arihant Jain, Arista Networks
Description: Arihant outlines how Ethernet is expanding into scale-up scenarios and how cooling, optics, and switch silicon are converging toward 2026 deployments.
Shortlink: https://ngi.fyi/tef25-arista-arihant
17. Cathy Liu on OIF’s Newly Published CEI-448G Framework
Presenter: Cathy Liu, OIF
Description: Cathy introduces the CEI-448G electrical framework and urges cross-standards collaboration to align electrical, optical, and system-level roadmaps.
Shortlink: https://ngi.fyi/tef25-oif-cathy
18. Jim Hsieh on Interoperability and Multi-Vendor Readiness
Presenter: Jim Hsieh, MediatekDescription: Jim discusses why industry-wide collaboration is critical to achieving reliable multi-vendor interoperability across electrical channels, PHYs, and optics as speeds push toward 1.6T and beyond.
Shortlink: https://ngi.fyi/tef25-mediatek-jim19. Adee Ran on Power, Yield, and Manufacturability Constraints
Presenter: Adee Ran, Cisco Systems
Description: Adee explains how design tradeoffs in SerDes, packaging, and optical interfaces interact with manufacturability, cost, yield, and the realities of AI-scale deployments.
Shortlink: https://ngi.fyi/tef25-cisco-adee