Converge Digest

Innovium raises $170 million for its switching silicon

Innovium, a start-up based in San Jose, California, raised $170 million for its switching silicon solutions cloud and edge data centers.

The new funding round included investments from Premji Invest, DFJ Growth, funds and accounts managed by BlackRock, and multiple strategic investors, along with existing investors including Greylock, Capricorn, WRVI, Qualcomm Ventures, Redline, S-Cubed Capital and DAG

. Innovium said this latest funding makes it the first network silicon company to achieve billion-dollar valuation “unicorn” status.

Earlier this year, Innovium unveiled its TERALYNX 8 silicon boasting 25.6Tbps switch with 112G SerDes

In addition, Innovium noted the following milestones during 1H 2020:

“We are delighted at the strong adoption at leading OEM, Cloud and ODM customers for our TERALYNX® family, which resulted in over 20% market share for 50G SerDes switch silicon in our first year of shipments. This additional funding, achieved despite ongoing macroeconomic uncertainty, validates our vision, execution and momentum in a multi-billion secular high-growth market,” said Rajiv Khemani, Co-founder and CEO of Innovium.

“Data centers are expected to see secular long-term expansion from Cloud, 5G, AI and remote-work applications. Innovative TERALYNX switch silicon products from Innovium have already been adopted by world’s leading hyperscale Cloud providers and leading OEMs including Cisco. We are excited to partner with Innovium for its roadmap innovation and help accelerate go-to-market ramp up,” said TK Kurien, Managing Partner and Chief Investment Officer at Premji Invest.

https://www.innovium.com/

Innovium pushes switching silicon to 25.6 Tbps with support for 112G PAM4

Innovium unveiled its TERALYNX 8 networking switch silicon featuring a massive 25.6 Tbps capacity and support for 112G PAM4 SerDes I/O. This next-generation TERALYNX 8 design features deep programmability, the largest on-chip buffers, and advanced telemetry capabilities.

Innovium’s TERALYNX 8 switch, which is aimed at hyperscale data centers and which is expected to sample in the second half of 2020, could be used for highly compact, highest port-density single-chip switches for 100G to 800G configurations, including 1RU, 32 x 800G switch. The silicon will be delivered in a single 7nm die fabricated by TSMC.

Innovium confirmed that its current generation, 12.7 Tbps switching silicon is already being used by numerous commercial customers, including some of the biggest cloud provider networks.

Some TERALYNX 8 highlights

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