Hakusan, SANWA Technologies and US Conec have signed agreements to expand multi-sourcing and development of MMC Very Small Form Factor (VSFF) multi-fiber optical connector and TMT ferrule solutions, targeting hyperscale data center and co-packaged optics deployments. The companies aim to scale industry supply of MMC connectors as next-generation architectures move beyond traditional MPO cabling toward higher-density optical interconnects.
MMC connectors support higher port densities and improved cable management compared to legacy MPO interfaces, making them well-suited for emerging server cluster designs and co-packaged or embedded optics platforms. Hakusan will manufacture and supply its TMT ferrules in both x12 and x16 fiber variants, leveraging more than three decades of MT ferrule engineering expertise. The collaboration with SANWA Technologies and US Conec seeks to ensure interoperability and second-source availability as hyperscale operators push toward 800G, 1.6T and higher-speed optical links.
Hakusan, one of the original developers of the MT ferrule, continues to serve data centers, telecom networks, aerospace and industrial markets from its headquarters in Kanazawa, Ishikawa, Japan. The company will maintain its independent brand while accelerating product development under the Lightera Group umbrella. The announcement reflects growing industry momentum behind MMC as a candidate interface for high-density optical I/O in AI-driven data center fabrics.
• Hakusan to supply TMT ferrules in x12 and x16 fiber configurations
• Focus on MMC VSFF connectors for hyperscale and co-packaged optics use cases
• Collaboration with SANWA Technologies and US Conec to support multi-sourcing
• Target markets include data centers, telecom, aerospace and industrial applications
“As one of the world’s first MT ferrule developers, Hakusan combines over 35 years of engineering expertise with advanced manufacturing capabilities to deliver high-precision, high-density solutions for next-generation optical systems,” the company stated.
🌐 Analysis
Lightera operates as the parent organization behind Hakusan and positions itself as a global optical connectivity platform focused on high-density interconnect technologies for AI data centers and advanced telecom infrastructure. The group has consolidated expertise in MT ferrule design, multi-fiber connector engineering and precision manufacturing, targeting the rapid scaling requirements of hyperscale and cloud operators. Hakusan, founded in Japan and recognized as an early MT ferrule innovator, now functions as an independent brand within Lightera while contributing core manufacturing IP and process know-how.
The rebranding under Lightera reflects a broader strategy to align traditional ferrule and connector businesses with next-generation architectures such as co-packaged optics (CPO), embedded optics and ultra-high-density pluggables. As AI clusters adopt 800G and 1.6T optical modules and begin evaluating 3.2T roadmaps, connector density, insertion loss and thermal performance become critical bottlenecks. By formalizing multi-source agreements with US Conec and SANWA Technologies, Lightera strengthens supply-chain resilience and positions MMC as an alternative to MPO in emerging CPO and disaggregated server designs. The move places the group in direct competition with other high-density interconnect ecosystems advancing new VSFF connector standards for AI-centric networking fabrics.
🌐 We’re tracking the latest developments in AI infrastructure and optical interconnects. Follow our ongoing coverage at: https://convergedigest.com/category/ai-infrastructure/
🌐 We’re launching the “Data Center Networking for AI” series on NextGenInfra.io and inviting companies building real solutions—silicon, optics, fabrics, switches, software, orchestration—to share their views on video and in our expert report. To get involved, send a note to jcarroll@convergedigest.com or info@nextgeninfra.io.