Oclaro introduced a new Add/Drop Routing Platform for next-generation multi-degree, colorless, directionless, contentionless, and flexible-grid (CDC-Flex) ROADM networks.
The new Oclaro platform integrates switching, arrayed amplification, as well as advanced control and monitoring. It can be used in a line-card, a managed subsystem or a super module.
Oclaro said its new Add/Drop Routing Platform makes significant gains in density and cost efficiency. Key platform components include:
- Highly-integrated cost- and space-efficient amplified multi-cast switches with variable optical attenuation (VOA) functionality for colorless, directionless, contentionless and flexible-spectrum add/drop routing in multi-degree ROADM architectures.
- Advanced arrayed optical amplifier implementations leveraging Oclaro’s industry leading 980nm pump portfolio that now also includes Oclaro’s uncooled dual-chip pumps. These pumps offer valuable power reduction and enable cost-effective high-density solutions.
- Multi-port flexible-grid optical channel monitor (OCM) that rapidly measures channel powers and frequencies of 8 DWDM input ports with the accuracy needed for flexible-grid network solutions. The OCM offers enhanced flexibility and incorporates advanced features such as port or channel dwelling and prioritization for signal analysis.
- Embedded control features to provide fast transient management and advanced signal processing capabilities to support the network intelligence required by next generation network solutions while also meeting customer’s stringent space and power constraints.
“The flexibility of the Add/Drop Routing Platform enables customers to specify customized subsystems that can meet their cost, density and time-to-market requirements while giving them the freedom to create truly differentiated network solutions,” said Per Hansen, Vice President of Product Marketing, Optical Networks Solutions, Oclaro, Inc. “Leveraging Oclaro’s recognized strengths in vertical integration combined with a broad set of optical networking components and subsystems, this new platform essentially assembles leading-edge functionalities into a highly-integrated and compact platform solution.”