What’s next for optical interconnects needed for next-gen AI clusters? Manish Mehta, VP Marketing from Broadcom’s Optical Systems Division, provides an insightful look into the advancements in this field:
– Manish discusses the progress in optical components, particularly the development of the terabit transceiver. He highlights Broadcom’s ongoing production of 100G vertical-cavity surface-emitting laser (VCSEL) and 100G electro-absorption modulated lasers (EMLs), and the upcoming showcase of 200G EMLs and 200 VCSELs that can be used in 1.6 terabit transceivers. This is a significant step forward for the next generation of AI networks.
– He also delves into the company’s investment in co-packaged optics, revealing the next phase of their 51.2 T co-packaged Ethernet switch product.
– Lastly, Manish touches on the ongoing debates and efforts in the industry to reduce the power of the optical interconnect, a goal targeted by both LPO and CPO. This is a crucial aspect of the industry’s evolution and one that Broadcom is keenly focused on.
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