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USB4 delivers 40Gbps bi-directionally
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USB4 delivers 40Gbps bi-directionally

The new USB4 spec was officially published by the USB Implementers Forum (USB-IF). The USB4 architecture is based on the Thunderbolt protocol specification recently…

Samsung intros 5G-integrated processor in 8nm
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Samsung intros 5G-integrated processor in 8nm

Samsung Electronics introduced its latest mobile processor, the Exynos 980, combining an integrated 5G modem and intelligent processing performance in a single chip. Mass…

Semtech debuts XGSPON chipset
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Semtech debuts XGSPON chipset

Semtech announced production availability of itsGN7153B combo chip and GN7055B multi-rate burst mode transimpedance amplifier (TIA) for XGSPON Optical Line Terminals (OLTs). Semtech’s GN7153B…

AT&T appoints Stankey as president & COO,
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AT&T appoints Stankey as president & COO,

AT&T appointed John Stankey as president and chief operating officer of AT&T Inc., reporting to Randall Stephenson, AT&T chairman and CEO. Stankey will also…

Huawei and China Telecom implement 5G Super Uplink
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Huawei and China Telecom implement 5G Super Uplink

China Telecom Shanghai announced the implementation of a 5G Super Uplink solution featuring TDD/FDD coordination, high-band/low-band complementation, and time/frequency domain aggregation. Super Uplink, which…

Huawei updates its 5G progress
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Huawei updates its 5G progress

Huawei Technologies issued the following update regarding its 5G momentum: 50 commercial contracts signed to date 28 contracts from Europe, 11 from the Middle…