Optical

OIF has released a new Implementation Agreement (IA) for 800LR, a single-wavelength 800G coherent optical interface designed for short-reach, high-volume applications such as data center interconnects (DCI), metro edge, and...

Avicena, a privately held startup based in Sunnyvale, California, announced a collaboration with TSMC to optimize photodetector (PD) arrays for its LightBundle microLED-based optical interconnects. The effort aims to extend...

As AI workloads push data center infrastructure to the limit, the industry’s need for faster, more efficient interconnects has never been more acute. That urgency was front and center at...

TDK unveiled a new photo-spintronic conversion element, dubbed the “Spin Photo Detector,” capable of responding at speeds of 20 picoseconds using 800 nm wavelength light—making it more than 10 times...

Windstream Wholesale has upgraded its optical infrastructure between Houston, Texas, and Tallahassee, Florida, with a new overbuild leveraging Ciena’s Reconfigurable Line System (RLS) and advanced monitoring tools. The enhanced route...

GlobalFoundries (GF) is at the forefront of advancing silicon photonics, a technology poised to revolutionize data center and high-performance computing interconnects. Their GF Fotonix™ platform integrates photonic, radio frequency (RF),...

Ranovus is working with Cerebras Systems under a $45 million DARPA contract to develop a next-generation high-performance computing platform that integrates Ranovus’ wafer-scale co-packaged optics with Cerebras’ wafer-scale AI chips. ...

Is wireless optical finally ready for the big time? New innovations mean that finally wireless optical can finally be unlocked. Mahesh Krishnaswamy, CEO from Taara, a recent spin-out from Google...

Aloe Semiconductor showcased two major advancements in silicon photonics during OFC 2025 in San Francisco, highlighting its commitment to scaling optical communications through advanced modulation techniques and photonic integration. The...

PacketLight Networks introduced the PL-8000M, a 2 x 800G muxponder platform designed for high-capacity transport in AI, cloud, and enterprise network environments. The device will be demonstrated live at OFC 2025, booth...

Telescent is showcasing a live demonstration of its new G5 optical patch panel with MPO-16 connectors at OFC 2025 in San Francisco. The system is capable of switching up to...

Ayar Labs introduced the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, the TeraPHY, aimed at enhancing AI infrastructure by delivering up to 8 Tbps bandwidth. Powered by...

Credo Technology announced the Lark family of ultra-low power optical DSPs, targeting 800G transceivers in AI-driven data centers and hyperscale cloud networks. Introduced at OFC 2025, the new Lark 800...