Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates designed for hyperscale data center compute applications. These advanced substrates are produced at SEMCO’s technology hub in...
NTT and Okayama University in Japan have developed a gigahertz ultrasonic circuit that utilizes the principle of topology. This innovative development promises to revolutionize the design and performance of ultrasonic...
Sivers Semiconductors AB (Sivers), a supplier of integrated chips and photonics modules for the most advanced communications and sensor solutions, appointed Vickram Vathulya as its new President & CEO, succeeding...
The U.S. Department of Commerce has announced a proposed investment of up to $400 million in direct funding under the CHIPS and Science Act to support GlobalWafers in constructing new...
The Department of Commerce and Natcast, operator of the National Semiconductor Technology Center (NSTC), have initiated the selection process for the first three R&D facilities funded by the CHIPS and...
SoftBank Group has acquired Graphcore, a UK-based start-up developing an Intelligence Processing Unit (IPU) platform designed for handling extremely large machine intelligence workloads. Graphcore’s latest Bow IPU leverages Wafer-on-Wafer (WoW)...
The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging in the United States. With up to $1.6 billion in...
Global sales of semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecasted to reach an unprecedented $109 billion in 2024, marking a 3.4% year-on-year growth, according to SEMI’s Mid-Year...
AMD agreed to acquire Silo AI, Europe’s largest private AI lab, for approximately $665 million in cash. This acquisition is a strategic move by AMD to enhance its end-to-end AI...
Applied Materials introduced groundbreaking materials engineering innovations designed to enhance the performance-per-watt of computer systems. These innovations enable copper wiring to scale to the 2nm logic node and below, addressing...
Samsung Electronics has announced a significant partnership with Preferred Networks, a leading Japanese AI company, to provide cutting-edge semiconductor solutions. The collaboration will utilize Samsung's 2-nanometer (nm) foundry process and...
GlobalFoundries announced the acquisition of Tagore Technology’s proprietary and production-proven Power Gallium Nitride (GaN) IP portfolio. This high-power density solution is designed to enhance efficiency and performance in various power...
Marvell introduced a high-performance, 1.6T PAM4 DSP for active electrical cables (AECs) designed for the greater connectivity bandwidth requirements between AI accelerators, server to top-of-rack links and switch-to-switch interconnects within...
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