SiTime introduced its SiT5977 Super-TCXO, a precision timing solution aimed at improving efficiency and scalability in AI-driven datacenters. As part of the company's Elite RF family, this single-chip solution offers...
MACOM announced a strategic capital investment plan of up to $345 million to modernize its semiconductor wafer fabrication facilities in Massachusetts and North Carolina. The five-year investment initiative aims to...
The Ultra Accelerator Link Consortium (UALink) expanded its Board of Directors with the election of Alibaba Cloud Computing Ltd., Apple Inc., and Synopsys Inc. The new board members bring extensive...
SK Telecom has officially launched its GPU-as-a-Service (GPUaaS) platform, hosted at its AI Data Center (AIDC) in Gasan, Seoul, offering scalable and flexible on-demand AI cloud services. This initiative, backed by SKT’s investment in Lambda, a global GPU...
The U.S. Department of Energy’s (DOE) Argonne National Laboratory will spearhead two groundbreaking microelectronics research projects aimed at advancing hardware and software co-design for next-generation computing. Funded through the CHIPS and Science Act...
Aetina announced a strategic collaboration with Qualcomm Technologies to deliver next-generation on-premises AI solutions. The partnership introduces the Aetina MegaEdge AIP-FR68, a groundbreaking desktop workstation powered by the Qualcomm Cloud AI 100 Ultra accelerator...
Intel announced the availability of its Adaptive Control Unit (ACU) U310 during CES 2025, designed for electric vehicle (EV) power trains and zonal controller applications. The ACU U310 consolidates multiple...
At CES 2025, NVIDIA introduced DRIVE AGX Thor, a centralized compute platform for next-generation autonomous vehicles. Built on the NVIDIA Blackwell architecture, DRIVE AGX Thor is the first system to...
Marvell introduced a custom AI accelerator (XPU) architecture featuring integrated Co-Packaged Optics (CPO) to enhance AI server performance. The new design supports higher bandwidth density and longer reach connections for...
The U.S. Department of Commerce has awarded Amkor Technology Arizona, Inc. up to $407 million under the CHIPS Incentives Program to establish a state-of-the-art semiconductor packaging and testing facility in...
ARIA Sensing has announced the launch of an Ultra-Wideband (UWB) Radar System-On-Chip (SoC) that offers 3D beamforming capabilities and programmable bandwidth up to 1.8 GHz. The chip integrates advanced waveforms...
The U.S. Department of Commerce has awarded Texas Instruments (TI) up to $1.61 billion in CHIPS Incentives Program funding to support the construction of three new semiconductor facilities in Texas...
The U.S. Department of Commerce awarded Samsung Electronics up to $4.745 billion in direct funding under the CHIPS Incentives Program, enabling the company to significantly expand its semiconductor manufacturing presence...
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