Credo Introduces 800G AECs with 7m Length
Credo Technology Group has launched its new 800G HiWire ZeroFlap (ZF) Active Electrical Cables (AECs) designed for AI backend networks. These advanced AECs provide enhanced reach, zero soft link flaps,...
Semiconductors
Silicon solutions for data centers, network infrastructure, and CPE
Astera Labs Unveils PCIe 6 Scorpio Switches for Cloud-Scale AI Platforms
Astera Labs unveiled its new Scorpio Smart Fabric Switch portfolio, targeting cloud-scale AI infrastructure with PCIe 6 connectivity. Designed for demanding AI workloads, the Scorpio switches aim to deliver high...
Qualcomm Delivers Wi-Fi 7 + AI with 33 Gbps Peak Capacity
Qualcomm Technologies has introduced its new Networking Pro A7 Elite platform, bringing Wi-Fi 7 connectivity and powerful edge AI processing to home and enterprise networks. Equipped with a Qualcomm Hexagon...
Broadcom Unveils 50G PON Silicon with AI/ML Capabilities
Broadcom launched its 50G PON OLT-ONU merchant silicon platform, integrating AI/ML processing at the edge to accelerate telecom applications. The new chips allow operators to manage high-bandwidth demands while running...
MaxLinear Debuts AI-Powered Wi-Fi
MaxLinear has introduced its MaxAI, a hardware-optimized machine learning (ML) framework aimed at improving quality of service (QoS) for multiple system operators (MSOs). The new technology integrates directly into MaxLinear’s...
Cerebras Files for IPO, Aiming to Revolutionize AI with its Wafer-Scale Chip
Cerebras Systems, a start-up based in Sunnyvale, California, has officially filed for an initial public offering (IPO), aiming to raise capital to expand its operations and capture a larger share...
Fujitsu and Supermicro Target AI Data Centers and Liquid-Cooling
Fujitsu and Supermicro formed strategic partnership to co-develop and market a high-performance platform based on Fujitsu’s upcoming “FUJITSU-MONAKA” Arm-based processor. Scheduled for release in 2027, the processor is designed to...
DARPA Awards $10.2M Contract to HexaTech for 100 mm AlN Substrate
HexaTech has secured a multi-year contract with the Defense Advanced Research Projects Agency (DARPA) under the Ultra-Wide Bandgap Semiconductors (UWBGS) program. The project aims to develop 100 mm aluminum nitride...
Video: What’s Next for Linear Pluggable Optics (LPO)?
Check out other Tech Updates on our YouTube Channel (subscribe today): https://www.youtube.com/@NextGenInfra and check out our latest reports at: https://nextgeninfra.io/ In this conversation, Jim Carroll and Armond Hairapetian discuss the...
Corning Introduces a New Material for EUV Chipmaking
Corning introduced EXTREME ULE Glass, a new material designed to meet the increasing demands of chipmakers working with extreme ultraviolet (EUV) lithography. This next-generation glass, engineered for high numerical aperture...
Alphawave Semi Releases 3nm UCIe Subsystem, Built on TSMC’s CoWoS
Alphawave Semi announced the availability of its 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem. Built on TSMC’s advanced Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, this subsystem is designed...
Sivers Semi Lands $6M in CHIPS Act Funding
Sivers Semiconductors has secured $6 million in first-year funding from the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. CHIPS and Science Act. The funding, part of the Microelectronics Commons...
Broadcom, Charter, and Comcast Partner to Bring 25 Gbps DOCSIS Chipsets
Broadcom, Charter Communications, and Comcast announced a joint effort to develop Unified DOCSIS chipsets, designed to support both FDX and ESD versions of the DOCSIS 4.0 specification. These chipsets are...
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