The Chips for America program is investing $3 billion in the National Advanced Packaging Manufacturing Program to boost semiconductor leadership in the US. This initiative focuses on advanced packaging technology,...
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The Chips for America program is investing $3 billion in the National Advanced Packaging Manufacturing Program to boost semiconductor leadership in the US. This initiative focuses on advanced packaging technology,...
Read moreInfinera has been awarded a $14 million CalCompetes grant to expand and modernize their US-based semiconductor production, supporting innovation and economic development.
Read moreDell Technologies, Hewlett Packard Enterprise, and Lenovo are set to integrate NVIDIA Spectrum-X Ethernet networking technologies into their server lineups. This new class of Ethernet networking offers 1.6x higher networking...
Read moreMediaTek completed 5G New Radio (NR) and 5G reduced capability (RedCap) interoperability development testing (IODT) of its 5G modem based on the 3GPP Release 17 (Rel-17) standard using Keysight’s 5G...
Read moreMediaTek introduces the T300 series, the world's first 6nm RFSOC designed for RedCap applications, offering cost-effective and energy-efficient solutions for IoT devices.
Read moreMediaTek introduces Filogic 860 and Filogic 360 chipsets, supporting Wi-Fi7. Filogic 860 is ideal for enterprise access points, service providers, retail, and IoT routers. Filogic 360 delivers next-gen Wi-Fi 7...
Read moreKulicke and Soffa Industries confirms multiple orders for its Thermocompression Bonding solutions, supporting Silicon Photonics-based Co-Packaged Optics applications. Anticipates more orders for aggressive capacity expansion in 2024-2025.
Read moreAt SC23 in Denver, Intel is showcased AI-accelerated high performance computing (HPC) data center technologies. In partnership with Argonne National Laboratory, Intel shared progress on the Aurora generative AI (genAI)...
Read moreEricsson introduced its most advanced RAN Compute products to date, designed for the network demands of 5G Advanced and enhanced artificial intelligence (AI) algorithms and powered by latest generation of...
Read moreMicrosoft has unveiled custom-designed chips and integrated systems for its Azure hyperscale data centers, including an AI accelerator chip and a cloud-native chip. They also introduced Azure Boost for faster...
Read moreAdtran is integrating the Intel NetSec Accelerator Reference Design with its Ensemble Cloudlet solution to enhance edge cloud deployments with advanced security, faster data processing and improved networking performance. The...
Read moreNVIDIA launched its H200 Tensor Core GPU based on its Hopper architecture and designed with advanced memory to handle massive amounts of data for generative AI and high performance computing...
Read more"Overall, IDC expects the total semiconductor industry to decline by 12% in 2023, which is an improvement from our September outlook. Revenues will continue to recover gradually and accelerate in...
Read more© 2023 Converge Digest - A private dossier for networking and telecoms.
© 2023 Converge Digest - A private dossier for networking and telecoms.