Intel has been awarded Phase Three of the DoD's RAMP-C program, showcasing readiness in process technology and high-volume manufacturing with Intel 18A.
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Intel has been awarded Phase Three of the DoD's RAMP-C program, showcasing readiness in process technology and high-volume manufacturing with Intel 18A.
Read moreIntel Foundry has received and assembled the industry’s first High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography system, a next-generation lithography system developed by ASML. The ASML TWINSCAN EXE:5000...
Read moreBy James E. Carroll, Editor Intel provided an update on its large-scale neuromorphic systems based on its human brain-inspired Loihi 2 processors. Neuromorphic computing refers to a type of computing...
Read moreSamsung Electronics is set to receive up to $6.4 billion in funding under the CHIPS Act, boosting their presence in Texas with new facilities and job opportunities.
Read moreAchieving scale-up and scale-out AI systems requires an advanced networking fabric. In his keynote. Intel CEO Pat Gelsinger said he expects Ultra Ethernet to meet this requirement. Intel plans to...
Read moreTSMC is to receive up to $6.6 billion in direct funding under the CHIPS and Science Act to support its investment of more than $65 billion in three greenfield leading-edge...
Read moreSK hynix plans to invest an estimated $3.87 billion to build a state-of-the-art advanced packaging fabrication and R&D facility for AI products in West Lafayette, Indiana. SK hynix is the...
Read moreCelestial AI secures $175 million in Series C funding for its Optical Compute Interconnect, promising lower latency and power consumption. Exciting advancements in optical interconnect technology!
Read moreAcacia introduces 800G DSP-based pluggable modules for metro DCI upgrades, supporting QSFP-DD and OSFP form factors compliant to OIF 800ZR.
Read moreCoherent Corp. unveils I-temp 100G ZR QSFP28 DCO transceiver for outdoor deployment in edge networks, offering expanded temperature range and low power consumption.
Read moreThe U.S. Department of Commerce proposes $8.5 billion in funding for Intel's semiconductor projects, aiming to boost American innovation in AI era.
Read moreNVIDIA introduces Blackwell platform, honoring mathematician David Harold Blackwell. Leveraging six new technologies for AI training and LLM inference.
Read moreBroadcom unveils Bailly, the first 51.2 Tbps CPO switch for AI clusters, promising lower power consumption and higher efficiency. #BroadcomAI #CPO
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© 2023 Converge Digest - A private dossier for networking and telecoms.