Inphi Intros 400GbE PAM4 for Next-Gen CFP8 Modules
Inphi announced a 400GbE platform solution for next-generation 400G CFP8 modules.
The solution uses Inphi’s highly integrated, lowest power 4-level Pulse Amplitude Modulation (PAM4) digital signal processing (DSP) IC, which supports IEEE P802.3bs 400G/s Ethernet standard alongside its linear TIAs and linear drivers for client based cloud interconnects.
Inphi said its the foundation of its 400G PAM4 PHY IC is a highly configurable and DSP Engine that can be targeted to multiple different performance oriented applications for optical based interconnects, while keeping an extremely low power profile.
The solution multiple channels along with transmit and receive PAM4 and forward error correction (FEC) functions on a single package.
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You just read about Inphi. One of the companies whose work it now carries:
Cortina Systems built Ethernet, optical transport and access communications silicon. What became of it?
Cortina Systems brought Ethernet, optical transport and access communications silicon to Semiconductor. That work was distinctive enough to lead to its acquisition by Inphi for US$131M. The standalone name now passes into the archive — but the team and technology continue inside Inphi today. One of 430 names here whose work outlived the company.
You just read about Optical. A technology from the archive that helped get us here:
SONET / SDH served 1988–2020. What ultimately replaced it?
SONET / SDH a synchronous TDM hierarchy that framed tributaries into standard optical rates (OC-3/12/48...), multiplexed by a master clock, with fast (<50 ms) ring protection over redundant fiber paths. Its job passed to OTN — but the problem it solved, and the ideas it proved, live on in what replaced it. The standard rests here in the archive. One of 198 technologies here that opened a door and then held it for the next.
Inphi said its the foundation of its 400G PAM4 PHY IC is a highly configurable and DSP Engine that can be targeted to multiple different performance oriented applications for optical based interconnects, while keeping an extremely low power profile.
