At the DesignCon 2023, scheduled for Jan 31 – Feb 2 in Santa Clara, California, speakers from OIF will present on-going to address electrical interfaces optimized for new electrical and optical architecture aspirations, including 224 Gbps and the co-packaging of optical and electrical interfaces with ASICs.
Tuesday, Jan 31, 2023: 4:45-6:00 pm PT
Enabling Next Generation Co-Packaging Solutions
Moderator: Jeff Hutchins, OIF Physical & Link Layer (PLL) Working Group Co-Packaging Vice Chair and Board Member, Ranovus
Panelists include Jeff Hutchins; Kenneth Jackson, Sumitomo Electric Device Innovations, USA; Yi Tang, Cisco; Nathan Tracy, OIF Market Awareness & Education Committee Co-Chair, PLL, TE Connectivity; and Richard Ward, Astera Labs
OIF experts will summarize OIF’s work on studying the various co-packaging applications, the technical tradeoffs and choices between different approaches, OIF’s projects, and future co-packaging trends. The panel will also cover OIF’s work to create standards (interoperability agreements) that foster the development of a co-packaging ecosystem.
Wednesday, Feb 1, 2023: 4:00 pm-5:15 pm PT
Enabling Next Generation Architectures: 224 Gbps Electrical Interfaces
Moderator: Nathan Tracy, OIF MA&E Committee Co-Chair PLL, TE Connectivity
Panelists include; John Calvin, Keysight; Mike Klempa, OIF PLL Interoperability Working Group Chair, Alphawave IP Group; Mike Li, OIF Board Member, Intel; Cathy Liu, OIF President, Broadcom Inc.
This session will include lessons learned from 112 Gbps and how those lessons are being leveraged for the new 224 Gbps work in OIF. Experts will also discuss the challenges OIF must overcome to enable 224 Gbps electrical I/O interface solutions where reach, performance, power, and cost optimizations become paramount. These solutions are critical to keep the industry moving forward with the next generation of interoperable electrical I/O interface specifications that address the escalating network power consumption trends.
