Semtech said it is showcasing live demonstrations at OFC 2026 spanning 224G and 448G solutions for AI and data center interconnect applications, including live 1.6T and 3.2T copper and optical connectivity demonstrations. The company said the exhibits highlight both scale-up and scale-out interconnect use cases, including active copper cables and multi-vendor optical links.
Among the demonstrations, Semtech said it is showing 1.6T active copper cables using GN8234 redriver ICs running live traffic to NVIDIA 224G/lane SerDes, as well as 3.2T active copper cable capability using its next-generation GN8304 redriver at 448G per channel. The company also pointed to multi-vendor 1.6T optical interconnect demonstrations, positioning its portfolio across both optical and copper portions of the AI interconnect stack.
The announcement reflects Semtech’s effort to present itself not just as a point-component vendor, but as a broader signal-chain supplier for AI infrastructure. As data centers prepare for the transition from 800G to 1.6T and beyond, analog, redriver, TIA, and driver technologies are becoming more important to the overall pace of system deployment.
Key points
• Semtech is demonstrating live 1.6T and 3.2T interconnect technologies at OFC 2026
• Demos span both copper and optical AI interconnect applications
• Includes 1.6T active copper cable demos tied to NVIDIA 224G/lane SerDes
• Includes 3.2T active copper cable demos at 448G per channel
• Also highlights multi-vendor 1.6T optical interconnect demonstrations
“The companies defining AI infrastructure are integrating across the signal chain — not assembling it from fragmented point solutions,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “Semtech has been building that position deliberately, and OFC is where customers see it in action: live 1.6T and 3.2T demonstrations, multi-vendor ecosystem validation and a portfolio that now extends deeper into the optical stack than ever before.”
🌐 Analysis
Semtech’s announcement stands out because it bridges copper and optical interconnects at a time when both remain essential to AI system design. Not every AI connectivity problem is solved with optics alone. Short-reach scale-up links, active copper cable designs, and signal-conditioning silicon still matter, especially as systems move toward 224G and 448G signaling.
The company is also making a broader strategic point: the interconnect market is consolidating around vendors that can address multiple parts of the signal chain. For system designers, that can reduce integration risk as the industry moves toward 1.6T and 3.2T architectures.
