OCP Launches Chiplet Marketplace
The Open Compute Project Foundation (OCP) has launched the OCP Chiplet Marketplace, marking a major step towards realizing the Open Chiplet Economy. This platform…
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Recent Chiplets stories
Intel Shows its Optical Compute Interconnect (OCI) Chiplet at Hot Chips
At Hot Chips 2024, Intel presented a series of advancements across AI and compute technologies, including showcasing its integrated optical compute interconnect (OCI) chiplet…
Universal Chiplet Interconnect Express 2.0 Spec Released
The Universal Chiplet Interconnect Express (UCIe) Consortium has unveiled its 2.0 Specification, marking a significant advancement in the standardization of system architecture for chiplet…
CHIPS R&D Office offers $1.6 Billion for Advanced Packaging
The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging in the United States.…
Samsung’s 2nm Process and Advanced Packaging to power AI accelerators
Samsung Electronics has announced a significant partnership with Preferred Networks, a leading Japanese AI company, to provide cutting-edge semiconductor solutions. The collaboration will utilize…
Intel highlights 4 Tbps optical compute interconnect chiplet
Intel announced an integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU, representing a leap forward in high-bandwidth interconnect by enabling co-packaged…
Rapidus and IBM target 2nm chiplet packaging technology
Rapidus, headquartered in Tokyo, and IBM announced a partnership focused on 2nm chiplet packaging technology. Rapidus will leverage IBM’s advanced semiconductor packaging technology. This…
Tech Update: Calculating the Costs/Benefits of Chiplets
Should you consider a chiplet for your next semiconductor project or stick with a conventional, monolithic design? Marek Hempel, Staff Process Development Engineer from…
Tech Update: Highlights of Chiplet Summit 2024
Discover the highlights of the Second Annual Chiplet Summit, showcasing the industry's growing interest in chiplet technology and its potential for AI acceleration. Learn…
Alphawave Semi demos 112G SERDES on TSMC 3nm
Alphawave Semi demonstrated its first connectivity silicon platform on TSMC’s most advanced 3nm process with its ZeusCORE Extra-Long-Reach (XLR) 1-112Gbps NRZ/PAM4 serialiser-deserialiser (SerDes) IP.…
Building a new Chiplet Economy
What will it take to create a vibrant ecosystem where innovative chipset designs can easily be integrated with other semiconductors and aligned to specific…
OCP releases Bunch of Wires (BoW) spec for chiplet interconnect
The OCP Foundation released its Bunch of Wires (BoW) specification for Chiplet interconnect, representing a next step in the OCP Open Domain Specific Architecture…