Lumentum introduced new indium phosphide (InP) photonic chip technologies, including 400 Gbps-per-lane and 200 Gbps-per-lane optical links, along with ultra-high-power lasers for co-packaged optics. These solutions address the twin challenges of bandwidth scaling and power efficiency in AI back-end networks, which are doubling in speed roughly every two years.
At the event, Lumentum is showcasing two live 400 Gbps-per-lane demonstrations. The first features a 448 Gbps externally modulated laser (EML) using 224 GBaud PAM4 signaling in partnership with Keysight Technologies and NTT Innovative Devices. The second highlights a 450 Gbps PAM4 distributed feedback (DFB) laser with integrated Mach-Zehnder modulation for long-reach applications. Both rely on Lumentum’s high-bandwidth InP platform. For 200 Gbps-per-lane performance, Lumentum is now delivering EML-based transmitters and a lens-integrated photodiode (LIPD), engineered to improve power efficiency and signal fidelity.
Lumentum also unveiled ultra-high-power 1310 nm DFB lasers designed for co-packaged optics, offering high density and lower energy consumption. These lasers are integrated into NVIDIA’s Spectrum-X and Quantum-X photonic switches. As demand for high-speed, power-efficient optical interconnects rises, Lumentum is positioning its InP platform as a foundation for the next wave of AI data center growth.
Key Points:
• 448G EML using 224 GBaud PAM4 demonstrated with Keysight and NTT.
• 450G PAM4 DFB-MZI laser provides low chirp and high signal integrity for long-reach links.
• 200G DD EML offers lower drive voltage and reduced power dissipation.
• 200G Lens Integrated Photodiode supports flip-chip bonding, improving integration and bandwidth.
• Ultra-High-Power 1310 nm DFB lasers support CPO and are featured in NVIDIA Spectrum-X and Quantum-X platforms.
“Lumentum InP technology is also enabling new co-packaged optics solutions to significantly reduce power consumption in AI data center networks, supporting larger AI installations and accelerating the transition from copper to photonic interconnects,” said Matt Sysak, Lumentum CTO of Cloud and Networking.
