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Home » Artimi Samples Single UWB Chip

Artimi Samples Single UWB Chip

May 30, 2005
in Uncategorized
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Artimi., a start-up based in Santa Clara, California with R&D in Cambridge, UK, announced first silicon of its single chip UWB solution. Samples will be made available to development partners for early design-ins.

Artimi’s UWB solution is a single chip implemented in SiGe BiCMOS. The digital portion of the device is implemented in CMOS and the high frequency section implemented in SiGe. The chip can process up to 4GHz of coherent bandwidth and includes integrated LNA and PA, adaptive channel digital radio, IEEE 802.15.3 MAC, standard PCI 2.3 interface with master/slave, flexible expansion port with dedicated RISC I/O processor and is designed to be compliant with FCC Part 15 Subpart F. Additional features include Artimi’s strong QoS technology that supports streaming media without any other processing
in the solution.

Artimi said that with an underlying 800 Mbps transport capability, plus
integrated error correction and encryption, its RTMI-100 chip is ideal for high bandwidth wire replacement, such as high performance bulk file transfers or where quality of service is important, like streaming audio and video between a DVD player and an LCD home theater system. Artimi is working with leading manufacturers in the consumer electronics, PC and mobile markets to develop end user products based on its UWB technology. http://www.artimi.com

  • In July 2004, Artimi announced $14 million in Series A funding for its development of Ultra Wideband (UWB) silicon solutions. Artimi is developing a low cost, single chip solution that aims to extend the range and boost the performance of UWB connectivity. Artimi’s UWB chips could be used for applications such as interconnecting flat panel displays, DVD, DVR and other multimedia devices. The company participates in standard-setting industry bodies, including IEEE 802.15 working groups and the Multi-Band OFDM Alliance (MBOA).
  • Artimi was co-founded by Mark Moore and David Baker. Moore was most recently Principal Architect with GlobespanVirata, having been a member from the company’s early days as ATM Ltd, to its subsequent re-branding as Virata and flotation on NASDAQ. Baker previously was Principal ASIC Engineer at GlobespanVirata and Technical Director of RWA.
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