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Celestial AI’s CTO Phil Winterbottom took the stage at IEEE Hot Chips 2025 at Stanford University to detail the company’s Photonic Fabric roadmap, expanding on concepts introduced earlier this month...

Rapidus CEO Atsuyoshi Koike outlined Japan’s accelerated push into next-generation semiconductor manufacturing during his keynote at Hot Chips 2025 at Stanford University on August 26. Speaking on his birthday, Koike...

GlobalFoundries (GF) spotlighted a broad set of technology innovations at its Technology Summit 2025 – North America in Santa Clara, with Dr. Ted Letavic, CTO of Advanced Technology Development, outlining...

At its annual Global Technology Summit (#GTS25)in Santa Clara, Niels Anderskouv, President and Chief Opernating Officer at GlobalFoundries, identified three forces reshaping the semiconductor landscape: the rise of AI and...

Amkor Technology will build its new U.S. advanced packaging and test facility on a 104-acre site within the Peoria Innovation Core in north Peoria, Arizona. The company revised its plans...

At this week’s Hot Chips 2025 at Stanford University, AMD outlined the native AI architecture of its Instinct MI350 Series GPUs and platforms, emphasizing advances in memory bandwidth, compute throughput,...

CrowdStrike reported strong Q2 FY26 results, posting revenue of $1.17 billion, up 21% year-over-year, with subscription revenue at $1.10 billion. Annual recurring revenue (ARR) grew 20% to $4.66 billion, including...

Marvell introduced the industry’s first 64 Gbps per wire bi-directional die-to-die (D2D) interconnect IP in 2nm, targeting next-generation XPUs for AI and cloud infrastructure. The technology, also available in 3nm,...

Crusoe has expanded its partnership with atNorth, scaling its Crusoe Cloud capacity at the ICE02 data center in Iceland to 57MW. The new 24MW agreement builds on an initial 33MW...

Broadcom used VMware Explore 2025 in Las Vegas to unveil a sweeping set of updates to VMware Cloud Foundation (VCF), positioning the platform as an AI-native private cloud environment with...

OpenLight has raised $34 million in an oversubscribed Series A round to accelerate the commercialization of its heterogeneously integrated photonics technology for AI data centers. The funding was co-led by...

At the IEEE Hot Interconnects conference, Sharada Yeluri of Astera Labs outlined why UALink (Ultra Accelerator Link) is emerging as the open protocol standard for rack-scale AI infrastructure. Designed specifically...

Avicena sees a huge opportunity to reshape AI cluster design with its microLED-based interconnects, a technology it says could slash energy use while breaking through the short-reach limits of copper....