Nokia Brings MCP-Based Agentic AI to Multi-Vendor Operations
June 11, 2026
Nokia has enhanced its Network Services Platform (NSP) with a new agentic AI framework designed specifically for IP network operations, enabling operators to deploy AI agents that reason over real-time network data and take guided actions within operator-defined policy and security boundaries. The framework embeds agentic AI directly into Nokia’s network automation platform, which already serves as a management and control layer for multi-vendor IP networks. The new framework addresses a key challenge facing service
Colt and Ciena Achieve 800GbE Quantum-Safe Across the Atlantic
June 10, 2026
Colt Technology Services and Ciena announced the successful completion of what the companies describe as the fastest quantum-safe data transmission demonstrated across a transatlantic route. The trial secured live traffic between New York and London over 6,900 km (4,287 miles) of Colt’s terrestrial and subsea infrastructure using Ciena’s WaveLogic 6 Extreme (WL6e) optical platform, while delivering an 800GbE service rate. The demonstration highlights the growing industry focus on protecting data against future quantum computing threats
AWS Launches Graviton5 CPU with 192 Cores for Agentic AI
June 10, 2026
Amazon Web Services (AWS) has made its new Graviton5 processor generally available, positioning the Arm-based CPU as a key platform for the growing class of agentic AI applications that require real-time reasoning, code generation, and orchestration of complex tasks. Available through Amazon EC2 M9g and M9gd instances, Graviton5 delivers up to 25% higher compute performance than the previous generation while offering the highest CPU core density in Amazon EC2 with 192 cores per package. AWS
Dell’Oro: AI Infrastructure Spending Pushes 2026 Data Center Capex Above $1 Trillion
June 10, 2026
Global data center capital expenditures are on track to exceed $1 trillion in 2026 as hyperscalers accelerate AI infrastructure deployments and memory pricing inflation raises the cost of server systems, according to a new report from Dell’Oro Group. The research firm increased its 2026 forecast following stronger-than-expected spending in the first quarter. Dell’Oro said the four largest U.S. cloud providers—Amazon, Google, Meta and Microsoft—increased data center capital expenditures by 78% year-over-year during the quarter. Alongside
TDK Acquires Fabric8Labs to Scale Advanced Cooling for AI Data Centers
June 10, 2026
TDK Corporation has agreed to acquire Fabric8Labs, a San Diego-based developer of Electrochemical Additive Manufacturing (ECAM) technology, in a move aimed at scaling production of advanced thermal management, power delivery, and RF components for AI data centers and next-generation electronics. The transaction remains subject to customary closing conditions and regulatory approvals. Fabric8Labs’ ECAM process enables precision metal manufacturing through electrochemical deposition, creating complex structures that are difficult or impossible to produce using conventional manufacturing methods.
Xanadu Sets New Benchmark for Ultra-Low-Loss Photonic Chip Packaging
June 10, 2026
Xanadu announced a new milestone in photonic chip packaging, achieving an average edge-coupling loss of just 0.085 dB per facet for its integrated photonic chips. The result addresses one of the most significant technical challenges in photonic quantum computing, where optical losses directly affect system performance, scalability, and the feasibility of fault-tolerant quantum architectures. The Toronto-based company said the achievement resulted from advances across photonic chip design, fabrication processes, and packaging technologies. Edge-coupling loss measures
