CPO

Lumentum is expanding U.S.-based manufacturing capacity for ultra-high-power (UHP) lasers used in Co-Packaged Optics (CPO) platforms, a key technology for next-generation AI data centers. The company will increase production at...

Jerusalem-based Teramount raised $50 million in new financing to accelerate production of its fiber-to-chip optical interconnect solutions for AI, data centers, and advanced computing. Koch Disruptive Technologies (KDT) led the...

Ayar Labs has appointed Vivek Khanzodé as Vice President of Engineering and expanded its operations in both the U.S. and Asia to support rising demand for co-packaged optics (CPO) in...

The explosive growth of cloud computing, artificial intelligence (AI), and high-performance computing (HPC) is pushing data center networks toward unprecedented bandwidth demands. As switch capacities leap from 25.6 Tbps to...

Drut Technologies has announced a strategic collaboration with Ranovus to deliver a commercially available co-packaged optics (CPO) solution aimed at next-generation AI, ML, and high-performance computing (HPC) workloads. The integration...

Broadcom has launched its third-generation co-packaged optics (CPO) platform featuring 200G per lane optical connectivity, pushing the performance envelope for AI-scale networks. The company also reaffirmed the maturity of its...

Broadcom is advancing rapidly through the next generations of Co-Packaged Optics (CPO) technology, laying the groundwork for scalable, high-density interconnects purpose-built for AI and cloud data centers. In a recent...

Corning announced a strategic collaboration with Broadcom to supply critical optical components for the Bailly co-packaged optics (CPO) system—Broadcom’s 51.2 Tbps Ethernet switch targeting AI-driven data centers. The partnership advances...

At the Intel Direct event in San Jose, Kevin O’Buckley, SVP and GM of Intel Foundry Services, delivered a candid address focused on aligning Intel’s foundry roadmap with the fast-evolving...

Check out OFC Conference and Exposition 2025 videos here: https://ngi.fyi/ofc25yt How is Marvell revolutionizing rack-scale connectivity for next-gen data centers? George Hervey, Principal Architect from Marvell explains: - New co-package...

GlobalFoundries (GF) is at the forefront of advancing silicon photonics, a technology poised to revolutionize data center and high-performance computing interconnects. Their GF Fotonix™ platform integrates photonic, radio frequency (RF),...

Marvell Technology is advancing co-packaged optics (CPO) switching technology to meet the escalating demands of AI and high-performance computing infrastructures. Which is better? Optics or Copper?  https://youtu.be/to7qdDK94QQ George Hervey, Principal...

At OFC 2025, Lightmatter introduced two groundbreaking products—Passage™ M1000 and Passage™ L200/L200X—that redefine the future of AI infrastructure by delivering record-breaking bandwidth and eliminating interconnect bottlenecks. These next-generation 3D photonic superchips and co-packaged optics...