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CPO

CPO: Co-Packaged Optics
Optical interconnect technology for next-generation AI and hyperscale data center networks
What it isCo-Packaged Optics integrates optical engines close to, or within the same package as, high-capacity switch ASICs to reduce electrical reach, power consumption, and signal-loss challenges.
Why it mattersCPO is viewed as a potential path to higher bandwidth density and improved energy efficiency as AI clusters, cloud fabrics, and data center interconnects scale toward 51.2T, 102.4T, and beyond.
Key driversAI clusters
Power efficiency
Bandwidth density
Switch scaling
Technical focusCPO development spans optical engines, switch ASIC packaging, external laser sources, thermal design, serviceability, standards work, and migration paths from pluggable optics.
Market contextThe industry continues to evaluate where CPO fits alongside advanced pluggables, linear pluggable optics, near-packaged optics, and silicon photonics-based interconnect architectures.
Converge Digest tracks CPO as part of its ongoing coverage of optical networking, AI infrastructure, silicon photonics, data center switching, and next-generation interconnect technologies.

Latest reporting

Recent CPO stories

Ayar Labs lands $15m DoD project for Optical I/O
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Ayar Labs lands $15m DoD project for Optical I/O

Ayar Labs was awarded a $15 million multi-year prototype Other Transaction Agreement (OTA) in support of Project KANAGAWA (the Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output…

OIF releases Co-Packaging Framework IA
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OIF releases Co-Packaging Framework IA

OIF published a framework Implementation Agreement (IA) for co-packaging of communication and computing interfaces with one or more ASICs. The document identifies critical co-packaged…