Cisco Launches 51.2T Routing System for Distributed AI Workloads
Cisco introduced the Cisco 8223 routing system, a 51.2 Tbps fixed router designed to anchor the “scale-across” era of AI networking. Powered by the new Silicon One P200 chip, the...
Semiconductors
Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Qualcomm to Acquire Arduino, Expanding Its Edge AI
Qualcomm Technologies announced plans to acquire Arduino, the open-source hardware and software pioneer whose ecosystem spans more than 33 million active users worldwide. The acquisition aims to merge Qualcomm’s edge...
AMD and OpenAI Ink 6-Gigawatt GPU Deal
AMD and OpenAI have signed a multi-year, multi-generation agreement to deploy up to 6 gigawatts of AMD Instinct GPUs, beginning with the MI450 series in 2H 2026. The deal positions AMD as...
Amkor Expands AZ Investment to $7B for Advanced Semiconductor Packaging Campus
Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its total planned investment to $7 billion. The expansion adds a second greenfield...
Alphawave Semi Tapes Out UCIe 3D Chiplet on TSMC
lphawave Semi has completed the tape-out of its UCIe™ 3D chiplet IP on TSMC’s SoIC-X platform, delivering up to 10x power efficiency and 5x signal density over traditional die-to-die interfaces....
Napatech Debuts 400G DPU with Altera FPGA
Napatech introduced the F3070X Data Processing Unit, a 400G acceleration platform powered by Altera Agilex FPGA and Intel Xeon D technology. Designed for AI, cloud, and enterprise datacenters, the new...
Corintis Raises $24M and Teams with Microsoft on In-Chip Cooling
Corintis raised $24M in Series A funding to scale its microfluidic chip cooling technology, aiming to tackle the growing thermal bottleneck in AI datacenters. Microsoft validated the approach with a...
NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has released a Broad Agency Announcement (BAA) soliciting proposals for research, prototyping, and commercial solutions to strengthen U.S....
ECOC25: Coherent Unveils 1.6 Tbps 2D VCSEL/PD Arrays
Coherent has introduced its next-generation 2D VCSEL and photodiode arrays, targeting short-reach optical interconnects for AI-driven datacenters. Announced ahead of ECOC 2025 in Copenhagen, the new arrays are designed to...
Cadence Expands TSMC Partnership with AI-Driven Design
Cadence announced a major expansion of its collaboration with TSMC to accelerate AI and HPC semiconductor design, covering advanced EDA flows, 3D-IC packaging, and high-performance IP. The partnership spans process...
Alphawave Semi Tapes Out 64 Gbps UCIe Gen3 on TSMC 3nm
Alphawave Semi announced the tapeout of its 64 Gbps UCIe Gen3 IP subsystem on TSMC’s 3nm (N3P) process, setting a new benchmark for die-to-die connectivity in chiplet-based architectures. The design...
Marvell Expands Share Repurchase by $5B, CEO Outlines AI and Data Center Pipeline
Marvell Technology (NASDAQ: MRVL) authorized a new $5 billion stock repurchase program and launched a $1 billion accelerated share repurchase (ASR) agreement with a major financial institution. The announcement comes...
SiTime Enters $4B Resonator Market with Titan Platform
SiTime (NASDAQ: SITM) has entered the $4 billion resonator market with the launch of its new Titan Platform™, a family of MEMS resonators built on the company’s sixth-generation FujiMEMS™ technology....
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