Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Broadcom began shipping its Jericho3-AI switching siicon chip for delivering high-performance Ethernet for GPU clusters supporting AI workloads. The Jericho3-AI fabric offers 26 petabits per second of Ethernet bandwidth, almost...
The Open Compute Project Foundation (OCP) released of a new chiplet interconnect link layer specification and an evolution of its previously-released Bunch of Wires (BoW) PHY specification. The development of...
Marvell demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on TSMC's 3-nanometer (3nm) process. This includes Marvell's 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes,...
SK hynix announced sampling of the first 12-layer HBM3 product with a 24 GB memory capacity -- the largest in the industry to date. HBM (High Bandwidth Memory) vertically interconnects...
The Rambus GDDR6 PHY delivers a market-leading data rate of up to 24 Gigabits per second (Gbps), providing 96 Gigabytes per second (GB/s) of bandwidth per GDDR6 memory device. GDDR6...
The European Parliament and the Council reached agreement to proceed with a European Chips Act aimed at strengthening European competitiveness and resilience in this strategic sector. The European Union aims...
Intel Foundry Services (IFS) and Arm agreed to undertake design technology co-optimization (DTCO), in which chip design and process technologies are optimized together to improve power, performance, area and cost...
Rambus has joined the Intel Foundry Services (IFS) Accelerator IP Alliance. Through the alliance, Rambus will have access to Intel's process roadmaps to provide advanced security and interface IP solutions...
Sony Semiconductor Solutions announced a strategic investment in aspberry Pi Ltd. (RPL). The minority investment cements the relationship between the two companies, to provide a development platform for SSS's edge...
Banias Labs achieved first-pass silicon success for its optical DSP SoC using Synopsys 112G Ethernet PHY IP and EDA Design Suite. Synopsys provided Banias Labs with a comprehensive IP solution...
AI from the cloud to the network and to the edge was the persistent theme in an investor webinar hosted by Intel and focused on the company’s Data Center and...
Enfabrica, a start-up based in Mountain View, California, emerged from stealth to unveil a new class of Accelerated Compute Fabric (ACF) chips optimized for Artificial Intelligence (AI) and accelerated computing...
Intel introduced its NUC 13 Pro, a small, enterprise-class PC with up to a 13th Gen Intel Core i7 processor with six Performance-cores (P-cores) and eight Efficient-cores (E-cores). Highlights Support...
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