Semiconductors

STMicroelectronics and GlobalFoundries agreed to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full...

Samsung Electronics confirmed initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. The company is starting the first application of the nanosheet transistor with semiconductor chips...

GlobalWafers, a leading provider of semiconductor wafers based in Hsinchu, Taiwan, announced plans to build a state-of-the-art, silicon wafer factory in Sherman, Texas.The new 300-millimeter facility represents a multi-billion dollar...

MaxLinear introduced its next-generation MODEM System on Chip (SoC), developed in partnership with Aviat Networks. The MxL852xx will integrate MaxLinear’s highest performance capabilities to provide a compact and complete MODEM solution,...

Cerebras Systems announced an ability to train models with up to 20 billion parameters on a single CS-2 system.The Cerebras WSE-2 is the largest processor ever built, boasting 2.55 trillion...

Renesas Electronics introduced its SmartBond DA1470x Bluetooth low energy (LE) system-on-chip (SoC) family for wireless connectivity.Key features of the DA1470x Wireless SoCsMulti core system – Arm® Cortex-M33 processor as the...

by James E. CarrollII‐VI has taped-out its Steelerton digital signal processor (DSP) for 100 Gbps coherent transmission in optical access and aggregation networks.  The company says its Steelerton DSP, miniaturized...

Source Photonics announced a big milestone: it has surpassed shipment of more than two million 28G high speed EML laser chips for data centers and optical transmission applications. Source Photonics began...

Marvell announced a significant milestones: the cumulative shipment of more than 100,000 400G Coherent Digital Signal Processors (CDSPs).Marvell's CDSP portfolio includes Canopus, the industry's first 7nm CDSP enabling 400G ZR/ZR+,...

Renesas Electronics will demonstrated a microcontroller (MCU) based on the recently announced Arm Cortex-M85 processor at the Embedded World 2022 Exhibition and Conference in Nuremburg Germany from June 21-24.Renesas introduced...

AWS announced the general availability of Amazon Elastic Compute Cloud (Amazon EC2) C7g instances, the next generation of compute-optimized instances powered by AWS-designed Graviton3 processors.AWS says its AWS Graviton3 processors...

Intel unveiled its IPU roadmap extending through 2026, featuring new FPGA + Intel architecture platforms (code-named Hot Springs Canyon) and the Mount Morgan (MMG) ASIC, as well as next-generation 800GB...

Marvell agreed to acquire privately-held Tanzanite Silicon Solutions, a start-up based in Milpitas, California that is developing advanced Compute Express Link (CXL) technologies. Terms of the all-cash transaction were not...