Semiconductors

Cadence Design Systems has optimized its chip design software for Samsung Foundry’s advanced-process technologies down to 4nm. The companies said Cadence digital 20.1 flow provides capabilities that are well-suited for Samsung...

Intel launched its 3rd Gen Xeon Scalable processors (code-named “Ice Lake”) featuring an average 46% improvement on popular data center workloads over the previous generation.The new Xeon processors, which are...

OpenFive, a SiFive Business Unit, introduced a Die-to-Die (D2D) PHY that complements the company’s existing D2D Controller to offer complete D2D interface solutions for various packages including substrates and interposers.OpenFive...

Arm introduced its v9 architecture which is expected to become the processing basis for hundreds of billions of devices in the years ahead.Armv9, which is the first new Arm architecture...

Analog Devices announced an ASIC-based radio platform for O-RAN compliant 5G radio units. The solution includes all the core functionality needed in an O-RAN compliant 5G radio unit, including a...

Samsung Electronics and Marvell have  jointly developed a new System-on-a-Chip (SoC) to power Samsung’s Massive MIMO and other advanced radios.The new SoC supports 5G and 4G networks simultaneously, and it...

 NXP introduced its first cloud-secured crossover applications processor, the i.MX 8ULP-CS with Azure Sphere. The processor is based on the ARM Cortex A35 is aimed at IoT applications requiring continuous...

Qualcomm Technologies introduced its Snapdragon 780G 5G Mobile Platform featuring a triple Image Signal Processor (ISP) capable of capturing from three cameras simultaneously (zoom, wide, and ultra-wide lenses).It is powered...

Samsung Electronics began sampling a 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology. The memory module delivers more than twice the performance of DDR4 at up to 7,200...

Intel CEO Pat Gelsinger outlined the company’s path forward to an integrated device manufacturing model. The IDM2 strategy has 3 elements:Building Intel’s global, internal factory network for at-scale manufacturing. Intel...

The U.S. Defense Advanced Research Projects Agency (DARPA) is launching an industry collaboration with Intel to expand access to domestic manufacturing capabilities for custom chips for defense systems. DARPA's Structured Array...

Xilinx expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. The company's Artix and Zynq UltraScale+ devices are now available in TSMC’s state-of-the-art InFO...

Renesas Electronics Corporation was struck by a fire in the N3 Building (300mm line) of its Naka Factory (located in Hitachinaka, Ibaraki Prefecture) on March 19, 2021 at 2:47am.The fire...