IBM announced a silicon process breakthrough that integrates wireless communications into a single power-management chip, a first that can cut production costs by about 20% while allow chip designers and manufacturers to create a new class of semiconductors. IBM foresees ultra-small and wirelessly enabled chips that control power usage in “smart” buildings, energy grids and transportation systems.
IBM’s wireless power management technology will use 180nm lithography to create advanced power-optimizing chips. IBM is rolling out the new chip-making process to manufacturers in the consumer electronics, industrial, automotive, digital media and alternative-energy segments. The company’s semiconductor plant in Burlington Vt., will be the primary manufacturing location for the new technology. IBM is already accepting designs from customers and is scheduling full production for the first half of 2011.
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