In Focus: Silicon

Montage Technology has launched sampling of its latest PCIe® 6.x/CXL® 3.x Retimer, designated M88RT61632. Designed for high-bandwidth applications such as ...

Intel celebrated first light from a new extreme ultraviolet (EUV) lithography system at its Fab 34 site in Leixlip, Ireland. ...

Samsung Electronics and NAVER Corporation are collaborating on semiconductor solutions tailored for hyperscale artificial intelligence (AI) models. The partnership leverages Samsung’s ...

Marvell is providing its OCTEON DPU technology to augment Nokia’s 5G “Powered by ReefShark” chipset processing portfolio for 5G radio ...

Analog Devices introduced the first Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) chipsets.Potential SPoE ...

AMD released the 4th Gen EPYC processors, code-named Genoa, boasting up to 96 cores in a single processor and aimed ...

Tektronix announced a collaboration with BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and integrated circuit packaging. This ...

More that 60 companies have come together to form a new Semiconductor Climate Consortium (SCC) to accelerate the ecosystem’s reduction ...

Marvell's first 3nm silicon is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle. Marvell said ...

Google Cloud introduced its Compute Engine C3 VMs powered by the 4th Gen Intel Xeon Scalable processor and Google’s custom ...

 The U.S. Department of Commerce’s Bureau of Industry and Security (BIS) announced a set of updates to its export controls ...

AIROHA, a subsidiary of Taiwan-based MediaTek,confirmed that is XGS-PON chips are now being used in customer premise equipment (CPE) by ...

At its annual Samsung Foundry Forum event in San Jose, California, Samsung Electronics outlined its goals to drive process nodes ...