Samsung’s 2nd gen SmartSSD computational drive offloads CPU
Samsung Electronics introduced a second generation of its pioneering SmartSSD computational storage drive that uses a Xilinx Versal Adaptive chip ...
ZEDEDA raises $26 million for edge orchestration
ZEDEDA, a start-up based in San Jose, California, raised $26 million in Series B funding for its edge orchestration solution.ZEDEDA ...
Quantifi Photonics raises $15M for optical test systems
Quantifi Photonics, a start-up based in Auckland, New Zealand, announced US$15 million in Series C funding for its solutions for ...
NEC selected for Juno transpacific cable
NEC has been contracted to build the JUNO Cable System, which is slated to be the highest capacity transpacific cable ...
Sparkle activates capacity on the Monet subsea cable
Sparkle has activated spectrum capacity on the Monet submarine cable system connecting Brazil to the United States. The addition enhances Sparkle's ...
SkyWater Tech plans a $1.8 billion semiconductor fab at Purdue
SkyWater Technology announced its plans to build a $1.8 billion U.S. semiconductor R&D and production facility in Indiana through a ...
Quantum Loophole builds highest-density fiber route to Ashburn
Quantum Loophole broke ground on its massive QLoop network, a 43-mile fiber ring connecting the company’s 2,100+ acre Quantum Frederick ...
Dell’Oro: Campus switch sales to exceed $95B over the next 5 years
More than $95 B will be spent on campus switches over the next five years, according to a new report ...
Sabey breaks ground on 40-acre data center campus near Austin
Sabey Data Centers has begun construction on a new, 40-acre data center campus in Round Rock, Texas. The new campus will ...
T-Mobile extends 5G Home Internet across California
T-Mobile has expanded the footprint of its 5G Home Internet across California.The fixed 5G service is now available to over ...
Keysight intros cloud-based Open RAN Architect Test
The Keysight Open Radio Access Network Architect (KORA) test solutions are moving to cloud-based deployment. In addition, the company’s LoadCore ...
OCP releases Bunch of Wires (BoW) spec for chiplet interconnect
The OCP Foundation released its Bunch of Wires (BoW) specification for Chiplet interconnect, representing a next step in the OCP ...
Dell’Oro: DWDM equipment market to surpass $17B by 2026
Demand for optical transport DWDM equipment is forecast to surpass $17 billion by 2026, according to a new report from ...
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