• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, June 28, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Qualcomm Elects MIT’s Dr. Susan Hockfield to Board

Qualcomm Elects MIT’s Dr. Susan Hockfield to Board

July 10, 2012
in All
A A

Dr. Susan Hockfield has been elected to Qualcomm’s Board of Directors. Dr. Hockfield’s previously served as president of the Massachusetts Institute of Technology (MIT) until July 2012, where she also holds a faculty appointment as professor of neuroscience.

“We are fortunate to welcome Dr. Hockfield as a member of Qualcomm’s Board of Directors,” said Dr. Paul E. Jacobs, chairman and CEO of Qualcomm. “Her leadership experience in exploring new horizons in biomedical and energy research adds a unique perspective to our Board and complements Qualcomm’s efforts to apply wireless technologies in fields such as healthcare and education.”
http://www.qualcomm.com

Tags: Blueprint columnsMobilePeopleQualcomm
ShareTweetShareSummarizeSummarize
Previous Post

NTT Communications Integrates Juniper’s Junos Pulse for BYOD

Next Post

Intel and ASML Aim to Accelerate Transition from 300 to 450mm Wafers

Staff

Staff

Related Posts

Financials

Orange Appoints Usman Javaid as Chief AI Officer

June 26, 2026
Financials

Guru Parulkar Takes Helm of Nokia Bell Labs Research

June 25, 2026
Semiconductors

xLight Appoints GlobalFoundries Executive Chairman Tom Caulfield to Board

June 25, 2026
Financials

Adtran Adds Cloud Veteran Anne DelSanto to its Board of Directors

June 25, 2026
Semiconductors

Qualcomm’s Dragonfly Data Center Platform / Meta CPU Deal

June 24, 2026
Semiconductors

Qualcomm to Acquire Modular, Strengthening AI Software Stack

June 24, 2026
Next Post

Intel and ASML Aim to Accelerate Transition from 300 to 450mm Wafers

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version