OCP releases Bunch of Wires (BoW) spec for chiplet interconnect
The OCP Foundation released its Bunch of Wires (BoW) specification for Chiplet interconnect, representing a next step in the OCP Open Domain Specific Architecture (ODSA) Project’s march towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. BoW specifies a physical layer (PHY) optimized […]





