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Home » Singapore’s Silicon Box targets chiplet fab and packaging

Singapore’s Silicon Box targets chiplet fab and packaging

July 20, 2023
in Semiconductors
A A

Silicon Box, a start-up based in Singapore, unveiled plans for a $2 billion advanced semiconductor foundry and packaging facility.

The venture, which as founded by Sehat Sutardja, his wife Weili Dai, and BJ Han, says it has developed a chiplet interconnect technology in sub 5 micron for design flexibility, power efficiency, and low manufacturing cost.

The 73,000 sqm facility in the district of Tampines will employ up to 1,200 people when fully developed.

“Silicon Box is well poised to solve the unique challenge for chiplets, which are essential to power emergent technologies. Our team of experts with over 30 years of multi-sectoral experience, critical ecosystem of partners and proprietary interconnection technology will shorten the design cycle of chiplets, lower new device costs, reduce power consumption and enable faster-time-to-market for industry partners involved in areas such as artificial intelligence (AI), data centres, electronic vehicles (EVs), mobile, and wearables, while protecting their intellectual property (IP),” states Dr. Han Byung Joon, CEO of Silicon Box.

Source: Economic Development Board of Singapore
Tags: FabSingapore
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