Chiplet Summit 2026: Qualcomm on the New Foundation of Chiplets
Santa Clara, Calif. — Feb. 18, 2026 – At today’s Chiplet Summit 2026, AlphawaveSemi — now part of Qualcomm — underscored that connectivity has…
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Santa Clara, Calif. — Feb. 18, 2026 – At today’s Chiplet Summit 2026, AlphawaveSemi — now part of Qualcomm — underscored that connectivity has…
Qualcomm completed its acquisition of Alphawave IP Group plc roughly one quarter ahead of schedule, bringing high-speed wired connectivity technology directly into its expanding…
Alphawave Semi announced the availability of its 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem. Built on TSMC’s advanced Chip-on-Wafer-on-Substrate (CoWoS)…
Alphawave Semi reported strong Q2 2024 results, with bookings reaching $107.4 million, up 27% year-over-year. The company attributed its success largely attributed to the…
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