Micron Unveils Highest-Capacity Low-Power DRAM for AI
Micron Technology introduced its 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), marking a new milestone in energy-efficient DRAM for ...
In Focus: DRAM
NEO Semiconductor unveils its X-DRAM
NEO Semiconductor introducted its X-DRAM, a new class of memory promising improvements over conventional DRAM by lowering the power consumption ...
Samsung begins mass production of 16GB LPDDR5 DRAM
Samsung Electronics announced that its second production line in Pyeongtaek, Korea, has commenced mass production of the industry's first 16-gigabit ...
Samsung ramps up module manufacturing with extreme ultraviolet tech
Samsung Electronics has shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based ...
Samsung debuts “Flashbolt” High Bandwidth Memory- 3.2 Gbps per pin
Samsung Electronics Co. announced its new High Bandwidth Memory (HBM2E) which promises to deliver the highest DRAM performance levels for ...
Samsung develops 8-gigabit LPDDR5 DRAM for 5G mobile devices
Samsung Electronics is ready to begin mass production of the first 10-nm class 8-gigabit LPDDR5 DRAM for use in upcoming ...
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