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Researchers of the Institute of Photonic Integration of the Eindhoven University of Technology are developing a hybrid memory that combines photonic properties and magnetic…
Samsung Electronics is ready to begin mass production of the first 10-nm class 8-gigabit LPDDR5 DRAM for use in upcoming 5G and Artificial Intelligence…
Samsung Electronics Co. started mass producing the industry’s first 32-gigabyte (GB) double data rate 4 (DDR4) memory. The small outline dual in-line memory modules…
Kingston Digital introduced a line of entry-level consumer-grade PCIe NVMe SSD utilizing 3D NAND for notebooks and desktop. The drive is available in 240GB,…
Integral Memory plc is introducing a 512GB microSDXC V10 UHS-I U1 memory card. The new card meets the Video Speed Class 10 (V10) standard,…
Samsung Electronics Co. has commenced mass production of the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced…
Toshiba and Western Digital celebrated the opening of the New Fab 2 semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan. The new facility…
HPE intends to support open source software on its futuristic platform billed as “The Machine.” The company announced its intent to bring The Machine…
Samsung Electronics announced the start of mass production of the industry’s first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules…
Micron Technology is working with Intel to deliver an on-package memory solution for Intel’s next-generation Xeon Phi processor, codenamed Knights Landing. The on-going collaboration…
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