
Micron Expands Automotive Memory Ecosystem
Micron Technology has completed a series of Strategic Customer Agreements (SCAs) with several of the automotive industry’s largest Tier 1 suppliers and ecosystem partners,…
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Micron Technology has completed a series of Strategic Customer Agreements (SCAs) with several of the automotive industry’s largest Tier 1 suppliers and ecosystem partners,…

SK Hynix shares rose roughly 13% in their U.S. market debut on Friday, closing at $168.01 after the South Korean memory manufacturer priced its…

The U.S. Department of Energy’s (DOE) Argonne National Laboratory will spearhead two groundbreaking microelectronics research projects aimed at advancing hardware and software co-design for next-generation computing.…

Alphawave Semi has announced a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform, achieving an unprecedented memory bandwidth of 1.2 Terabytes per…

Rambus announced that its HBM3 Memory Controller IP is now capable of up to 9.6 Gbps performance. This represents a 50% increase over the…

SK hynix previewed samples of its 321-layer 4D NAND at this week’s Flash Memory Summit (FMS) 2023 in Santa Clara, California. The company plans…

Software-defined memory systems have tremendous potential to accelerate innovation in large data centers. Manoj Wadekar, Hardware Systems Technologist, Meta, shares a perspective on…

Rambus has expanded its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing…

Rambus has begun sampling its 5600 MT/s 2nd-generation registering clock driver (RCD) chip to the major DDR5 memory module (RDIMM) suppliers. This new level…

Samsung Electronics began sampling a 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology. The memory module delivers more than twice the…

Samsung Electronics has shipped one million of the industry’s first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV)…

Samsung Electronics Co. announced its new High Bandwidth Memory (HBM2E) which promises to deliver the highest DRAM performance levels for use in next-generation supercomputers,…

Samsung Electronics Co. announced mass production of the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) package — the highest-capacity mobile DRAM…
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