Chiplet Summit 2026: UCIe Chair Debendra Das Sharma on the UCIe 3.0 Roadmap
Santa Clara, Calif. — Feb. 18, 2026 — At today’s Chiplet Summit 2026, Debendra Das Sharma, **Chair of the UCIe Consortium, laid out ...
In Focus: UCIe
Alphawave Semi Tapes Out 64 Gbps UCIe Gen3 on TSMC 3nm
Alphawave Semi announced the tapeout of its 64 Gbps UCIe Gen3 IP subsystem on TSMC’s 3nm (N3P) process, setting a ...
Hot Interconnects: UCIe Brings On-Package Memory to the Forefront
At the IEEE Hot Interconnects 2025, Intel’s Debendra Das Sharma outlined how the Universal Chiplet Interconnect Express (UCIe) can extend ...
Alphawave Semi Releases 3nm UCIe Subsystem, Built on TSMC’s CoWoS
Alphawave Semi announced the availability of its 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem. Built on ...
Universal Chiplet Interconnect Express 2.0 Spec Released
The Universal Chiplet Interconnect Express (UCIe) Consortium has unveiled its 2.0 Specification, marking a significant advancement in the standardization of ...
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