• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, June 3, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Xanoptix Secures $15.2M for High-density Chip-Chip Integration

Xanoptix Secures $15.2M for High-density Chip-Chip Integration

May 18, 2004
in Start-ups
A A

Xanoptix, a start-up based in Merrimack, New Hampshire, secured $15.2 million in additional funding for its 3D semiconductor integration and high-density parallel optics. Xanoptix is working to commercialize a new approach to semiconductor manufacturing – chip level direct die-to-die interconnection of integrated circuits, allowing system designers a modular building block approach for chip level solutions. The latest round was led by the company’s primary investors: William Blair Capital Partners, Euclid SR Partners, Envest Ventures and Optical Partners. http://www.xanoptics.com

Tags: All
ShareTweetShareSummarizeSummarize
Previous Post

Symantec to Acquire Brightmail for $370 Million

Next Post

Tasman Networks Secures $14.4 Million for Edge Routers

Staff

Staff

Related Posts

All

Blueprint: Building wholesale networks with OTN

December 20, 2022

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
All

Oracle opens cloud region in Chicago

December 20, 2022
All

BT trials C-RAN in Leeds

December 19, 2022

BT to combine Enterprise and Global units to create BT Business

December 19, 2022

euNetworks appoints Stephanie Lynch-Habib to President

December 19, 2022
Next Post

New York Rules Vonage is a Phone Company

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version