• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, June 10, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » CHIPS for America offers $285 million for Digital Twins in fabs

CHIPS for America offers $285 million for Digital Twins in fabs

May 8, 2024
in Semiconductors
A A

The U.S. Department of Commerce is seeking proposals to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry.

Digital twins are virtual models that mimic the structure, context, and behavior of a physical counterpart. The CHIPS for America Program anticipates up to approximately $285 million for a first-of-its-kind institute focused on the development, validation, and use of digital twins for semiconductor manufacturing, advanced packaging, assembly, and test processes. The CHIPS Manufacturing USA institute is the first Manufacturing USA institute launched by the Department of Commerce under the Biden Administration.

“Digital twin technology can help to spark innovation in research, development, and manufacturing of semiconductors across the country – but only if we invest in America’s understanding and ability of this new technology,” said Secretary of Commerce Gina Raimondo. “This new Manufacturing USA institute will not only help to make America a leader in developing this new technology for the semiconductor industry, it will also help train the next generation of American workers and researchers to use digital twins for future advances in R&D and production of chips.”

Source: Department of Commerce
Tags: CHIPs Act
ShareTweetShareSummarizeSummarize
Previous Post

Microsoft plans $3.3 billion data center in Wisconsin

Next Post

NTIA offers $420 million to promote Open Radio Units

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Semiconductors

NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics

September 25, 2025
Semiconductors

Natcast Leads U.S. National Semiconductor Technology Center with $6.3B Funding

January 16, 2025
Semiconductors

U.S. Department of Commerce Allocates $1.4 Billion for Advanced Semiconductor Packaging

January 16, 2025
Semiconductors

Four More Companies Land $264M in CHIPs Act Funding

January 16, 2025
Semiconductors

MACOM Unveils $345M Plan to Modernize Semiconductor Facilities

January 14, 2025
All

Amkor Secures $407M CHIPS Grant for Advanced Packaging

December 26, 2024
Next Post

Lumen partners with Versa on Sovereign SASE

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version