Alchip Technologies and Ayar Labs introduced a co-packaged optics (CPO) solution aimed at breaking copper interconnect bottlenecks in large-scale AI...

The LPO MSA introduced the 400G-FR4-LPO specification at ECOC 2025, extending linear pluggable optics to 400G Ethernet over four WDM...

Coherent unveiled a QSFP28 Dual Laser 100G ZR pluggable module for single-fiber, bi-directional applications, supporting a 10x capacity increase on...

Coherent unveiled its next-generation Multi-Rail platform at ECOC25, introducing a Dynamic Gain Equalizer that integrates C and L bands in...

Corintis raised $24M in Series A funding to scale its microfluidic chip cooling technology, aiming to tackle the growing thermal...

Equinix has unveiled a Distributed AI infrastructure that features an AI-ready backbone connecting over 270 data centers globally, along with...

Zayo and Equinix introduced a joint AI Infrastructure Blueprint that sets out a common model for building the networks and...

Applied Materials and GlobalFoundries (GF) are teaming up to advance photonics manufacturing for next-generation AI and augmented reality (AR) applications....

Coherent has begun sampling its latest 400 mW continuous-wave (CW) lasers designed for co-packaged optics (CPO) and silicon photonics, positioning...

NEC Corporation launched a new 25Gb/s SFP28 bi-directional (BiDi) optical transceiver designed for 80km transmission, expanding its optical product portfolio....

Nscale has raised $1.1 billion in Series B funding, the largest such round in European history, to accelerate its global...

Nokia has partnered with UK-based Nscale to accelerate the build-out of AI-ready data center infrastructure worldwide. Under the agreement, Nscale...

CoreWeave expanded its agreement with OpenAI to supply compute for training next-generation models in a deal valued up to $6.5...