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Aviz Networks Appoints Thomas Scheibe as Chief Product Officer t

Aviz Networks has appointed Thomas Scheibe as Chief Product Officer, reinforcing its focus on advancing AI-driven networking solutions, including Community SONiC and AI Agents with Network Copilot™. Scheibe brings over 25 years of leadership experience, previously driving product management for Cisco’s Data Center portfolio, where he played a pivotal role in launching Cisco’s first SONiC […]

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NVIDIA Unveils Blackwell-based Automotive AI Platform

At CES 2025, NVIDIA introduced DRIVE AGX Thor, a centralized compute platform for next-generation autonomous vehicles. Built on the NVIDIA Blackwell architecture, DRIVE AGX Thor is the first system to feature the Arm Neoverse V3AE CPU, optimized for automotive applications. The platform is designed to power software-defined vehicles (SDVs) with advanced generative AI capabilities for […]

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Department of Commerce Awards Hemlock Semiconductor $325M

The U.S. Department of Commerce has awarded Hemlock Semiconductor (HSC) up to $325 million under the CHIPS Incentives Program to strengthen domestic production of hyper-pure polysilicon, a critical material for advanced semiconductor manufacturing. The funding will support the construction of a new manufacturing facility in Hemlock, Michigan, with expectations to create approximately 180 permanent manufacturing […]

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Arizona State University to Host New CHIPS R&D Facility in Tempe

The Department of Commerce and Natcast have announced Arizona State University (ASU) Research Park in Tempe, Arizona, as the planned site for the third CHIPS for America research and development (R&D) flagship facility. The new Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF) will focus on bridging the gap between […]

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Intel Launches Core Ultra 200 Series Processors and Advances 18A Node

At CES 2025, Intel introduced its Core Ultra 200 series processors, featuring enhanced AI performance, power efficiency, and a diverse range of options for both mobile and desktop users. Alongside the new processors, Intel provided updates on its next-generation manufacturing technologies, including progress on the Intel 18A process node, designed to deliver higher transistor density […]

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Appellate Court Strikes Down FCC’s Title II Net Neutrality Regulations

The U.S. Court of Appeals for the Sixth Circuit has invalidated the Federal Communications Commission’s (FCC) decision to reimpose Title II regulations on broadband internet providers, a move championed by the Biden Administration. In a 3-2 vote last year, the FCC sought to apply utility-style oversight to the internet under the “Safeguarding and Securing the […]

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GlobalFoundries and IBM Settle All Litigation, Eye New Collaboration

GlobalFoundries and IBM have settled all ongoing litigation, ending legal disputes involving breach of contract, trade secrets, and intellectual property claims. The agreement, announced January 2, 2025, resolves all legal matters between the semiconductor manufacturer and the technology giant. Both companies indicated that the settlement opens the door for potential collaboration in areas of mutual […]

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Equinix Acquires BT’s Dublin Data Centers for €59 Million

Equinix and BT Group have announced a €59 million agreement for Equinix to acquire BT’s data center business in Ireland. The deal includes two well-established, carrier-neutral facilities located in CityWest and Ballycoolin, Dublin, encompassing approximately 150,000 square feet of space. The transaction is expected to close in the first half of 2025, pending competition and […]

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Amkor Secures $407M CHIPS Grant for Advanced Packaging

The U.S. Department of Commerce has awarded Amkor Technology Arizona, Inc. up to $407 million under the CHIPS Incentives Program to establish a state-of-the-art semiconductor packaging and testing facility in Peoria, Arizona. This project, part of a broader $2 billion investment by Amkor, will significantly enhance domestic supply chain resilience for advanced technologies such as […]

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U.S. Department of Commerce Awards $458M to SK hynix

The U.S. Department of Commerce has awarded up to $458 million in direct funding to SK hynix under the CHIPS Incentives Program. The funding supports the company’s $3.87 billion investment in West Lafayette, Indiana, to develop a cutting-edge memory packaging plant and advanced packaging R&D facility. This initiative aims to address a critical gap in […]

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Nokia and e& UAE Demo End-to-End Network Slicing for Gaming

Nokia and e& UAE have successfully showcased the world’s first fixed end-to-end network slicing solution optimized for gaming applications. Conducted in e& UAE’s Abu Dhabi labs, the trial used Nokia’s slicing solution to create dedicated, low-latency, high-speed network slices tailored for gaming and other premium services, such as remote work and enterprise applications. The demonstration […]

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Lightmatter Joins UALink Consortium to Redefine AI Interconnect

Lightmatter has joined the Ultra Accelerator Link Consortium (UALink) as a Contributor member to help establish high-speed, low-latency open interconnect standards for AI systems. Using its Passage™ technology—a 3D-stacked photonic engine—Lightmatter aims to enhance accelerator-to-accelerator communication, enabling bandwidths of up to hundreds of Tbps per chip and supporting the scalability of next-generation AI clusters. UALink […]

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Alianza to Acquire Metaswitch from Microsoft

Alianza agreed to acquire Metaswitch from Microsoft, aiming to bolster its cloud-native and AI communications platform for service providers. Financial terms were not disclosed. This acquisition expands Alianza’s customer base to over 1,000 communications service providers, including 19 of the top 20 global operators. Metaswitch’s portfolio of high-performance communications software will complement Alianza’s offerings, helping […]

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