100G and Beyond – @Huawei Comments at #OFC2015
What changes will we see as network transport evolves to 100G and beyond? Peter Ashwood-Smith, Technical VP of Optical Product Line at Huawei, breaks it down into a discussion of...
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Silicon Photonics Integrating photonic and electronic functions on silicon to power next-generation AI, cloud, and communications networks. | |
| Overview | Silicon photonics combines optical components—including waveguides, modulators, photodetectors, and multiplexers—with CMOS manufacturing processes to create high-performance, low-cost optical interconnects. The technology enables faster data movement while reducing power consumption compared with traditional electrical signaling. |
| Applications | Silicon photonics is widely deployed in hyperscale data centers, AI clusters, high-performance computing, telecom transport, data center interconnect (DCI), and increasingly in advanced chip-to-chip and package-level optical communications. |
| Key technologies | PICsCWDM/DWDMOptical EnginesIntegrated LasersCo-PackagingOptical I/O |
| AI infrastructure | The explosive growth of AI training and inference clusters is accelerating demand for silicon photonics as bandwidth requirements outpace conventional copper interconnects. Leading hyperscalers, semiconductor vendors, and optical component suppliers are investing heavily in photonic integration for future-scale AI systems. |
| Related topics | • Pluggable Optics use silicon photonics in many 400G, 800G, and emerging 1.6T transceivers. • Co-Packaged Optics (CPO) increasingly relies on silicon photonic optical engines integrated alongside switch ASICs. • Linear Pluggable Optics (LPO) and External Laser Pluggable Optics (XPO) represent emerging architectures built upon advances in silicon photonics. |
| Coverage | Converge Digest covers silicon photonics innovation across photonic integrated circuits (PICs), optical engines, AI networking, semiconductor manufacturing, packaging technologies, standards development, and commercial deployments by hyperscalers and networking vendors. |
| Explore related coverage: Pluggable Optics | Co-Packaged Optics (CPO) | LPO | XPO | |
What changes will we see as network transport evolves to 100G and beyond? Peter Ashwood-Smith, Technical VP of Optical Product Line at Huawei, breaks it down into a discussion of...
At this week's #OFC2015 in Los Angeles, Luxtera confirmed commercial availability of its 100G-PSM4 compliant chipset and QSFP optical module. The company said its low cost single mode products make...
Mellanox Technologies introduced three new LinkX 100 Gb/s solutions that support the high-density, low-power, QSFP28 connector-based Switch-IB switch platform. The Switch-IB 36-port 100Gb/s InfiniBand switch delivers 7.2Tb/s of aggregate throughput...
The OpenOptics MSA Consortium has published the first foundational Wavelength Division Multiplexing (WDM) specification for an interoperable 100G WDM standard for 2 kilometer reach, addressing data center interconnect (DCI) requirements....
M/A-COM Technology Solutions Holdings (MACOM) agreed to acquire BinOptics Corporation, a merchant provider of Indium Phosphide lasers, for $230 million in cash. BinOptics' highly differentiated edge-emitting and surface-emitting Fabry Perot...
NeoPhotonics agreed to acquire EMCORE Corporation's tunable laser and transceiver product lines for approximately $17.5 million, which consists of $15.0 million and a working capital and inventory adjustment of approximately...
An international team of researchers led by professor Roberto Morandotti of INRS-EMT in Canada announced a new method to achieve a different type of photon pair source that fits into...
Compass-EOS introduces its SDN Forwarding Plane, a new networking element that aims to replace expensive and complex routers used in service provider networks. The Compass-EOS said key attributes of its...
Google is collaborating with the University of California Santa Barbara to design and build new quantum information processors based on superconducting electronics. The research brings together Google's Quantum Artificial Intelligence...
IBM announced a $3 billion research initiative that aims to advance silicon technologies to the 7nm threshold or below. Over the next 5 years, IBM will conduct two broad research...
Intel announced microarchitecture and memory details of its next-generation Intel Xeon Phi processor (code-named Knights Landing) and an end-to-end interconnect fabric optimized for fast data transfers, both aimed at powering...
Researchers at Nippon Telegraph and Telephone (NTT) have developed a novel method to create an optical nanocavity at an arbitrary place on a silicon chip by placing a compound semiconductor...
"If it computes, it does it best with Intel" -- this statement underscores Intel's mission, said company CEO Brian Krzanich, speaking at the Intel Investor's Day conference in Santa Clara,...
© 2026 Converge Digest - A private dossier for networking and telecoms.
© 2026 Converge Digest - A private dossier for networking and telecoms.