Vertical Semiconductor, a spinout from MIT, secured $11 million in seed funding to commercialize vertical gallium nitride (GaN) transistors aimed at solving one of AI infrastructure’s most pressing challenges: efficient...
The Open Compute Project Foundation (OCP) announced major new contributions to its Open Chiplet Economy initiative, introducing the Foundation Chiplet System Architecture (FCSA) led by Arm and an enhanced BoW...
Upscale AI, a start-up based in Santa Clara, California, introduced SkyHammer, a ground-up interconnect architecture designed specifically for large-scale AI systems. Unlike conventional front-end switch or PCIe-based fabrics, SkyHammer aims to...
OpenAI has signed a multi-year collaboration with Broadcom to co-develop and deploy 10 gigawatts of OpenAI-designed AI accelerators and networking systems, marking one of the largest infrastructure partnerships in the...
Credo Technology introduced its ZeroFlap (ZF) optical transceiver family at the OCP Global Summit 2025 in San Jose, positioning it as a system-level solution to improve optical reliability in large-scale...
Intel is preparing to enter high-volume production of its Intel Core Ultra series 3 processors, code-named Panther Lake, at its new Fab 52 facility in Chandler, Arizona. The chips, built on...
Broadcom introduced its third-generation co-packaged optics (CPO) switch, the Tomahawk 6 – Davisson (TH6-Davisson), delivering 102.4 Tbps of optically enabled Ethernet switching capacity for next-generation AI networks. The new platform...
Cisco introduced the Cisco 8223 routing system, a 51.2 Tbps fixed router designed to anchor the “scale-across” era of AI networking. Powered by the new Silicon One P200 chip, the...
Qualcomm Technologies announced plans to acquire Arduino, the open-source hardware and software pioneer whose ecosystem spans more than 33 million active users worldwide. The acquisition aims to merge Qualcomm’s edge...
AMD and OpenAI have signed a multi-year, multi-generation agreement to deploy up to 6 gigawatts of AMD Instinct GPUs, beginning with the MI450 series in 2H 2026. The deal positions AMD as...
Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its total planned investment to $7 billion. The expansion adds a second greenfield...
lphawave Semi has completed the tape-out of its UCIe™ 3D chiplet IP on TSMC’s SoIC-X platform, delivering up to 10x power efficiency and 5x signal density over traditional die-to-die interfaces....
Napatech introduced the F3070X Data Processing Unit, a 400G acceleration platform powered by Altera Agilex FPGA and Intel Xeon D technology. Designed for AI, cloud, and enterprise datacenters, the new...
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