Alphawave Semi Tapes Out UCIe 3D Chiplet on TSMC
lphawave Semi has completed the tape-out of its UCIe™ 3D chiplet IP on TSMC’s SoIC-X platform, delivering up to 10x power efficiency and 5x signal density over traditional die-to-die interfaces....
Semiconductors
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Napatech Debuts 400G DPU with Altera FPGA
Napatech introduced the F3070X Data Processing Unit, a 400G acceleration platform powered by Altera Agilex FPGA and Intel Xeon D technology. Designed for AI, cloud, and enterprise datacenters, the new...
Corintis Raises $24M and Teams with Microsoft on In-Chip Cooling
Corintis raised $24M in Series A funding to scale its microfluidic chip cooling technology, aiming to tackle the growing thermal bottleneck in AI datacenters. Microsoft validated the approach with a...
NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has released a Broad Agency Announcement (BAA) soliciting proposals for research, prototyping, and commercial solutions to strengthen U.S....
ECOC25: Coherent Unveils 1.6 Tbps 2D VCSEL/PD Arrays
Coherent has introduced its next-generation 2D VCSEL and photodiode arrays, targeting short-reach optical interconnects for AI-driven datacenters. Announced ahead of ECOC 2025 in Copenhagen, the new arrays are designed to...
Cadence Expands TSMC Partnership with AI-Driven Design
Cadence announced a major expansion of its collaboration with TSMC to accelerate AI and HPC semiconductor design, covering advanced EDA flows, 3D-IC packaging, and high-performance IP. The partnership spans process...
Alphawave Semi Tapes Out 64 Gbps UCIe Gen3 on TSMC 3nm
Alphawave Semi announced the tapeout of its 64 Gbps UCIe Gen3 IP subsystem on TSMC’s 3nm (N3P) process, setting a new benchmark for die-to-die connectivity in chiplet-based architectures. The design...
Marvell Expands Share Repurchase by $5B, CEO Outlines AI and Data Center Pipeline
Marvell Technology (NASDAQ: MRVL) authorized a new $5 billion stock repurchase program and launched a $1 billion accelerated share repurchase (ASR) agreement with a major financial institution. The announcement comes...
SiTime Enters $4B Resonator Market with Titan Platform
SiTime (NASDAQ: SITM) has entered the $4 billion resonator market with the launch of its new Titan Platform™, a family of MEMS resonators built on the company’s sixth-generation FujiMEMS™ technology....
NVIDIA to Invest $100B in OpenAI, Pairing GPU Sales with Equity Stakes
OpenAI and NVIDIA unveiled plans for a massive strategic partnership centered on building at least 10 gigawatts of AI data centers powered by NVIDIA systems. The companies signed a letter...
ST Advances Panel-Level Packaging with New Pilot Line in France
STMicroelectronics (NYSE: STM) announced a major step forward in advanced chip packaging with plans to build a next-generation Panel-Level Packaging (PLP) pilot line at its Tours, France site. This facility,...
NVIDIA and Intel Forge $5B Partnership to Build Data Center and PC Chips
NVIDIA and Intel announced a sweeping collaboration to co-develop custom processors for AI infrastructure and personal computing, alongside a $5 billion NVIDIA investment in Intel common stock. The deal marks...
Groq Raises $750 Million as Inference Demand Surges
Groq secured $750 million in fresh financing at a $6.9 billion valuation, reinforcing its role in the U.S. AI technology stack. The round was led by Disruptive, with participation from...
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