Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
POET Technologies has signed a development partnership with NTT Innovative Devices to co-design a 100G Bidirectional Optical Engine for next-generation mobile front-haul networks. The collaboration combines POET’s Optical Interposer platform...
GlobalFoundries (GF) spotlighted a broad set of technology innovations at its Technology Summit 2025 – North America in Santa Clara, with Dr. Ted Letavic, CTO of Advanced Technology Development, outlining...
GlobalFoundries elevated its silicon photonics platform to a standalone product line and doubled investment in the technology, said Kevin Soukup, Senior Vice President, during his keynote at the company’s GTS2025...
Marvell Technology reported record revenue of $2.006 billion for its second quarter of fiscal 2026, marking a 58% increase from a year earlier. GAAP net income reached $194.8 million, or...
The U.S. Department of Commerce has moved to strip Natcast, a private nonprofit created under the Biden Administration, of its role as operator of the National Semiconductor Technology Center (NSTC)....
Marvell introduced the industry’s first 64 Gbps per wire bi-directional die-to-die (D2D) interconnect IP in 2nm, targeting next-generation XPUs for AI and cloud infrastructure. The technology, also available in 3nm,...
Rapidus announced a strategic collaboration with Keysight to co-develop a high-precision process design kit (PDK) and improve yield for its 2nm gate-all-around (GAA) logic node. The agreement taps Keysight’s parametric...
izmomicro, a division of izmo Ltd., announced a milestone in silicon photonics packaging, becoming the first company in India to demonstrate this level of integration. The company developed a high-density...
Xscape Photonics and Tower Semiconductor introduced an on-chip, optically pumped, multi-wavelength laser platform designed for AI datacenter fabrics. The prototype, available as a validation kit, is built on Tower’s PH18...
Intel secured a landmark deal with the Trump Administration, which will see the U.S. government invest $8.9 billion in Intel common stock to reinforce American leadership in semiconductor manufacturing. The...
AI clusters are hitting a wall with copper cabling, and Avicena CEO Bardia Pezeshki believes microLEDs are the way through. At this week’s IEEE Hot Interconnects online conference, he revealed...
At the IEEE Hot Interconnects 2025, Intel’s Debendra Das Sharma outlined how the Universal Chiplet Interconnect Express (UCIe) can extend the performance of on-package memory, offering a path to low-power,...
GlobalFoundries (Nasdaq: GFS) closed its acquisition of MIPS, a long-time provider of processor and AI intellectual property, in a move designed to strengthen its position in differentiated semiconductor manufacturing. The...
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