Softbank Bets $2B on Intel
SoftBank Group is committing $2 billion to Intel in a new strategic investment deal that underscores growing confidence in U.S. semiconductor leadership. The agreement, announced jointly by SoftBank and Intel,...
Semiconductors
Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Marvell Secures Microsoft Azure Cloud HSM with LiquidSecurity
Marvell Technology expanded its role in Microsoft’s cloud security ecosystem as Azure selected its LiquidSecurity hardware security modules (HSMs) for the Azure Cloud HSM service. Already powering Azure Key Vault...
Coherent Ramps 1.6T Optics, Triples Indium Phosphide Capacity
Coherent Corp. ended fiscal 2025 with record results and a sharper focus on next-generation optics for AI data centers. Full-year revenue climbed 23% year-over-year to $5.81 billion, driven by a...
Cadence and NVIDIA Break Power Analysis Limits for Billion-Gate AI Chips
Cadence has introduced the Palladium Dynamic Power Analysis (DPA) App, enabling semiconductor and systems designers to accurately measure and optimize power usage in billion-gate AI and ML chip designs before...
Dell’Oro: Merchant GPUs and Custom Accelerators to Hit $446B by ’29
The global Data Center Accelerator market is projected to reach $446 billion by 2029, according to a new report from Dell'Oro Group. Accelerators now account for roughly one third of total data...
AGY Launches L-HDI Glass Fiber for Chip Packaging
AGY has introduced L-HDI, a new low coefficient of thermal expansion (CTE) glass fiber designed for high-density interconnect (HDI) substrates and chip packaging in advanced AI hardware. Produced at the...
Trump Announces 100% Tariffs on Imported Semiconductors
President Trump announced 100% tariffs on imported semiconductors except for companies committed to building in the United States. Those companies, including Apple, will face a 0% tariff. However, if the...
OCP Unveils Universal Link Layer Spec to Boost Chiplet Interoperability
Open Compute Project (OCP) has released a new Universal D2D Transaction and Link-Layer specification that broadens support to UCIe and other PHY standards, enabling greater silicon diversity in AI and...
AMD Reports Strong Data Center Momentum Despite $800M GPU Export Impact
AMD posted record revenue of $7.7 billion in the second quarter of 2025, up 32% year-over-year, driven by strong sales of EPYC server processors and Ryzen client CPUs. Net income...
Astera Labs Q2 Revenue Jumps 150% YoY as PCIe 6
Astera Labs posted record financial results for the second quarter of fiscal 2025, reporting revenue of $191.9 million, up 20% sequentially and 150% year-over-year. GAAP net income reached $51.2 million...
Broadcom Ships Jericho4, Enabling Distributed AI Computing Across Data Centers
Broadcom has started shipping its Jericho4 Ethernet fabric router, a purpose-built platform for distributed AI and HPC infrastructure. Designed to interconnect over one million XPUs across multiple facilities, Jericho4 addresses...
AMD Licenses Arteris FlexGen for Chiplet Designs
Arteris announced a collaboration with AMD to integrate its FlexGen Network-on-Chip (NoC) interconnect IP into AMD’s next-generation AI chiplet designs. The agreement enables AMD to license FlexGen for use alongside...
Qualcomm Results Led by Automotive and IoT
Qualcomm reported fiscal third-quarter 2025 revenue of $10.4 billion, up 10% year-over-year, driven by record automotive revenues and continued strength in IoT. The company posted GAAP earnings per share of...
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