Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Intel CEO Lip-Bu Tan laid out his roadmap to restore the company’s leadership in semiconductor technology and manufacturing during his keynote a company event in Las Vegas. Drawing from decades...
Broadcom expanded its DSP PHY portfolio with two new products designed specifically for next-generation AI infrastructure: the Sian3 DSP PHY and the Sian2M DSP PHY. These 200G-per-lane DSPs target the...
SoftBank Group has announced it will acquire Ampere Computing, a Santa Clara-based silicon design company, in a $6.5 billion all-cash transaction. Ampere will become a wholly owned subsidiary of SoftBank...
NVIDIA kicked off its annual GPU Technology Conference (GTC) in San Jose, California, with a keynote from CEO Jensen Huang, unveiling a bold product roadmap set to redefine AI computing...
NVIDIA unveiled its next-generation silicon photonics switches—Spectrum-X Photonics Ethernet and Quantum-X Photonics InfiniBand—designed to scale AI factories to connect millions of GPUs while cutting energy consumption and improving performance. The new co-packaged...
Synopsys is deepening its collaboration with NVIDIA to accelerate semiconductor design workloads using the NVIDIA Grace Blackwell platform and CUDA-X libraries. The partnership aims to significantly reduce runtime across electronic...
Keysight Technologies has expanded its double-pulse test portfolio with a new measurement fixture designed to accurately characterize the dynamic behavior of Wide-Bandgap (WBG) power semiconductor bare chips. The fixture eliminates...
Intel named Lip-Bu Tan as its new chief executive officer, effective March 18, 2025. Tan, a veteran semiconductor executive and investor, previously served as CEO of Cadence Design Systems and...
AMD has introduced the 5th Gen AMD EPYC Embedded 9005 Series processors, designed to deliver high-performance, energy-efficient computing for networking, storage, and industrial edge applications. Built on the “Zen 5”...
Tower Semiconductor and Innolight have expanded their collaboration to ramp up high-volume production of next-generation silicon photonics (SiPho) solutions for AI and data center applications. Tower’s latest SiPho platform, now...
Taiwan Semiconductor Manufacturing Company (TSMC) has announced an additional $100 billion investment in U.S. semiconductor manufacturing, bringing its total planned investment to $165 billion. The expansion includes three new fabrication...
Marvell announced its first 2nm silicon IP, developed on TSMC’s advanced 2nm process, marking a major step in AI and cloud infrastructure innovation. The new platform is designed to enable...
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a master research agreement to enhance semiconductor technologies, particularly for artificial intelligence (AI) applications. This collaboration brings together...
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