Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Auradine, a start-up based in Santa Clara, California, has secured $153 million in Series C funding to expand its blockchain and AI infrastructure product lines, bringing its total capital raised...
AMD has achieved a key milestone by taping out and bringing up its next-generation EPYC processor, codenamed “Venice,” on TSMC’s 2nm (N2) node. The new chip becomes the first high-performance...
NVIDIA announced its commitment to begin manufacturing AI infrastructure solutions in the United States. For the first time, the company will produce entire AI supercomputers — including its powerful new...
Intel has agreed to sell a 51% stake in its Altera business to Silver Lake in a deal that values the programmable semiconductor company at $8.75 billion. The transaction sets...
NTT Corporation has unveiled a new low-power large-scale integration (LSI) chip capable of real-time AI inference processing on ultra-high-definition (4K, 30 fps) video for edge and power-constrained devices. The LSI...
The UALink Consortium officially released the UALink™ 200G 1.0 Specification, establishing an open industry standard for low-latency, high-bandwidth interconnects designed to scale AI accelerator performance in next-generation data center clusters....
IBM unveiled the z17 mainframe, the latest evolution of its enterprise computing platform, designed to bring AI acceleration directly into core infrastructure. Central to the system is the new IBM...
Marvell Technology agreed to sell its Automotive Ethernet business to Infineon Technologies AG in an all-cash deal valued at $2.5 billion. The business, anchored by Marvell’s Brightlane portfolio, is projected...
STMicroelectronics and Innoscience have signed a joint development and manufacturing agreement focused on gallium nitride (GaN) power technology, aiming to accelerate next-generation solutions for AI data centers, renewable energy, electric...
Ayar Labs introduced the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, the TeraPHY, aimed at enhancing AI infrastructure by delivering up to 8 Tbps bandwidth. Powered by...
Semiconductor startup Retym has officially launched from stealth mode with over $180 million in total funding, including a newly secured $75 million Series D round led by Spark Capital. The...
At OFC 2025, Broadcom showcased its powerful portfolio of optical and electrical interconnect solutions for AI infrastructure. The company highlighted advances across co-packaged optics (CPO), 200G/lane DSP and SerDes technologies,...
Cerebras Systems has secured a new contract from DARPA to develop a next-generation real-time compute platform combining its wafer-scale engine with Ranovus’ co-packaged optics. The system is designed to deliver...
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