Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
TeraSignal has announced successful interoperability testing between its TSLink intelligent chip-to-module (C2M) interconnect and Synopsys’ 112G Ethernet PHY IP. This collaboration highlights advancements in low-power, low-latency optical connectivity for AI...
by James E. Carroll Arm released of the first public specification for its Chiplet System Architecture (CSA), marking a major milestone in advancing chiplet-based silicon design. The CSA provides a standardized...
Baya Systems, a start-up based in Santa Clara, California, has raised over $36 million in a Series B funding round led by Maverick Silicon. Existing investors, including Matrix Partners and...
Montage Technology has launched sampling of its latest PCIe® 6.x/CXL® 3.x Retimer, designated M88RT61632. Designed for high-bandwidth applications such as artificial intelligence (AI) and cloud computing, this chip supports data...
Keysight Technologies has introduced Chiplet PHY Designer 2025, its latest software solution for high-speed digital chiplet design tailored to AI and data center applications. The new release incorporates support for emerging...
The U.S. Department of Commerce has finalized three CHIPS Incentives Program awards totaling $143 million to strengthen domestic semiconductor manufacturing and supply chain resilience. The funding supports projects by Corning...
GlobalFoundries plans to establish the New York Advanced Packaging and Photonics Center at its Malta, New York, manufacturing facility. This first-of-its-kind center, supported by investments from New York State and...
by James E. Carroll The U.S. Department of Commerce finalized its long-term partnership agreement with Natcast to manage the National Semiconductor Technology Center (NSTC) under an agreement with the National...
The U.S. Department of Commerce has announced the finalization of $1.4 billion in awards under the CHIPS National Advanced Packaging Manufacturing Program (NAPMP). These funds aim to strengthen the United...
The U.S. Department of Commerce announced preliminary terms for $246.4 million in proposed funding under the CHIPS and Science Act to support projects by Analog Devices, Inc. (ADI), Coherent Corp.,...
SiTime introduced its SiT5977 Super-TCXO, a precision timing solution aimed at improving efficiency and scalability in AI-driven datacenters. As part of the company's Elite RF family, this single-chip solution offers...
MACOM announced a strategic capital investment plan of up to $345 million to modernize its semiconductor wafer fabrication facilities in Massachusetts and North Carolina. The five-year investment initiative aims to...
The Ultra Accelerator Link Consortium (UALink) expanded its Board of Directors with the election of Alibaba Cloud Computing Ltd., Apple Inc., and Synopsys Inc. The new board members bring extensive...
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