Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
SK Telecom has officially launched its GPU-as-a-Service (GPUaaS) platform, hosted at its AI Data Center (AIDC) in Gasan, Seoul, offering scalable and flexible on-demand AI cloud services. This initiative, backed by SKT’s investment in Lambda, a global GPU...
The U.S. Department of Energy’s (DOE) Argonne National Laboratory will spearhead two groundbreaking microelectronics research projects aimed at advancing hardware and software co-design for next-generation computing. Funded through the CHIPS and Science Act...
Aetina announced a strategic collaboration with Qualcomm Technologies to deliver next-generation on-premises AI solutions. The partnership introduces the Aetina MegaEdge AIP-FR68, a groundbreaking desktop workstation powered by the Qualcomm Cloud AI 100 Ultra accelerator...
Intel announced the availability of its Adaptive Control Unit (ACU) U310 during CES 2025, designed for electric vehicle (EV) power trains and zonal controller applications. The ACU U310 consolidates multiple...
At CES 2025, NVIDIA introduced DRIVE AGX Thor, a centralized compute platform for next-generation autonomous vehicles. Built on the NVIDIA Blackwell architecture, DRIVE AGX Thor is the first system to...
Marvell introduced a custom AI accelerator (XPU) architecture featuring integrated Co-Packaged Optics (CPO) to enhance AI server performance. The new design supports higher bandwidth density and longer reach connections for...
The U.S. Department of Commerce has awarded Amkor Technology Arizona, Inc. up to $407 million under the CHIPS Incentives Program to establish a state-of-the-art semiconductor packaging and testing facility in...
ARIA Sensing has announced the launch of an Ultra-Wideband (UWB) Radar System-On-Chip (SoC) that offers 3D beamforming capabilities and programmable bandwidth up to 1.8 GHz. The chip integrates advanced waveforms...
The U.S. Department of Commerce has awarded Texas Instruments (TI) up to $1.61 billion in CHIPS Incentives Program funding to support the construction of three new semiconductor facilities in Texas...
The U.S. Department of Commerce awarded Samsung Electronics up to $4.745 billion in direct funding under the CHIPS Incentives Program, enabling the company to significantly expand its semiconductor manufacturing presence...
NXP Semiconductors (NASDAQ: NXPI) announced an all-cash deal to acquire Aviva Links, a provider of Automotive SerDes Alliance (ASA)-compliant connectivity solutions, for $242.5 million. The acquisition enhances NXP’s automotive networking...
The U.S. Department of Commerce finalized an award of up to $406 million in CHIPS Act funding to GlobalWafers America, LLC (GWA) and MEMC LLC, subsidiaries of Taiwan-based GlobalWafers Co.,...
The boom in AI data center construction is having a profound effect on semiconductors and network architecture.Chris Koopmans, Chief Operations Officer from Marvell shares his thoughts: - The hyperscaler market...
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