The Department of Commerce and Natcast, operator of the National Semiconductor Technology Center (NSTC), have initiated the selection process for the first three R&D facilities funded by the CHIPS and...
SoftBank Group has acquired Graphcore, a UK-based start-up developing an Intelligence Processing Unit (IPU) platform designed for handling extremely large machine intelligence workloads. Graphcore’s latest Bow IPU leverages Wafer-on-Wafer (WoW)...
The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging in the United States. With up to $1.6 billion in...
Global sales of semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecasted to reach an unprecedented $109 billion in 2024, marking a 3.4% year-on-year growth, according to SEMI’s Mid-Year...
AMD agreed to acquire Silo AI, Europe’s largest private AI lab, for approximately $665 million in cash. This acquisition is a strategic move by AMD to enhance its end-to-end AI...
Applied Materials introduced groundbreaking materials engineering innovations designed to enhance the performance-per-watt of computer systems. These innovations enable copper wiring to scale to the 2nm logic node and below, addressing...
Samsung Electronics has announced a significant partnership with Preferred Networks, a leading Japanese AI company, to provide cutting-edge semiconductor solutions. The collaboration will utilize Samsung's 2-nanometer (nm) foundry process and...
GlobalFoundries announced the acquisition of Tagore Technology’s proprietary and production-proven Power Gallium Nitride (GaN) IP portfolio. This high-power density solution is designed to enhance efficiency and performance in various power...
Marvell introduced a high-performance, 1.6T PAM4 DSP for active electrical cables (AECs) designed for the greater connectivity bandwidth requirements between AI accelerators, server to top-of-rack links and switch-to-switch interconnects within...
Etched.ai, a start-up based in Cupertino, California, has introduced its Sohu ASIC, a specialized chip designed specifically for transformer architecture-based artificial intelligence models. According to the company, Sohu is capable...
Intel announced an integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU, representing a leap forward in high-bandwidth interconnect by enabling co-packaged optical input/output (I/O) in emerging AI...
Cadence Design Systems introduced its Janus Network-on-Chip (NoC) technology for managing data delivery between silicon components in complex SoCs and disaggregated multi-chip systems. The Cadence Janus NoC manages these simultaneous...
Intel Foundry reported progress from several ecosystem partners on its Embedded Multi-die Interconnect Bridge (EMIB) technology, which is designed used to connect multiple silicon dies within a single package, allowing...
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