Intel Foundry reported progress from several ecosystem partners on its Embedded Multi-die Interconnect Bridge (EMIB) technology, which is designed used to connect multiple silicon dies within a single package, allowing...
Tenstorrent has licensed Baya Systems’ customizable WeaveIP fabric to scale its AI and RISC-V chiplet solutions. Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and...
Neoconix has begun shipping its latest board-to-board array connectors, the “Mini” (CBM) and SPH3 “Ultra,” powered by innovative C-Beam™ technology. These connectors are designed to support high-speed data rates of...
Renesas Electronics has acquired Transphorm (Nasdaq: TGAN), a supplier of gallium nitride (GaN) power semiconductors. With this acquisition, Renesas will immediately begin offering GaN-based power products and related reference designs...
Alphawave Semi has announced a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform, achieving an unprecedented memory bandwidth of 1.2 Terabytes per second (TBps) through chiplet-enabled technology. In...
Astera Labs has demonstrated end-to-end PCIe optical connectivity to provide unprecedented reach for larger, disaggregated GPU clusters. The company’s technology for PCIe over optics expands its Aries family of Smart...
onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic to produce intelligent power semiconductors for use in electric vehicles, renewable energy...
NVIDIA has achieved a remarkable milestone by more than tripling the performance on the large language model (LLM) benchmark, based on GPT-3 175B, compared to its record-setting submission from last...
Introducing the Logic Processing Array (LPA): A clock-less, lag-less, and asynchronous design offering true concurrent parallel processing without memory.
AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft agreed to develop an open industry standard for interconnecting AI accelerators. The Ultra Accelerator Link (UALink) group will...
Alphawave Semi is working with Arm to develop an advanced compute chiplet based on Arm Neoverse Compute Subsystems (CSS) for systems used in artificial intelligence/machine learning (AI/ML), high-performance computing (HPC),...
Rapidus, headquartered in Tokyo, and IBM announced a partnership focused on 2nm chiplet packaging technology. Rapidus will leverage IBM's advanced semiconductor packaging technology. This partnership is part of a broader...
ASML and imec (Interuniversity Microelectronics Centre), a renowned research and development organization based in Leuven, Belgium, inaugurated a new High NA EUV Lithography Lab in Veldhoven, the Netherlands. The new...
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