Semiconductors

The U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $450 million in proposed federal incentives under the CHIPS...

The Universal Chiplet Interconnect Express (UCIe) Consortium has unveiled its 2.0 Specification, marking a significant advancement in the standardization of system architecture for chiplet manageability. The new specification addresses key...

Intel reported disappointing financial results for the second quarter of 2024, prompting the tech giant to announce comprehensive job cuts and restructuring measures. The company revealed a 1% year-over-year decline...

On July 30th, AMD reported a revenue of $5.8 billion, marking a 9% year-over-year increase. The company’s gross margin was 49%, with an operating income of $269 million and a...

Marvell introduced its new Structera product line of Compute Express Link (CXL) devices, aimed at resolving memory performance and scaling challenges in cloud data centers. These devices are designed to...

Marvell Technology announced the production and customer deployment of its flagship 51.2 Tbps programmable Teralynx 10 Ethernet switch chip for cloud data centers. The Teralynx 10 is engineered to support...

Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates designed for hyperscale data center compute applications. These advanced substrates are produced at SEMCO’s technology hub in...

NTT and Okayama University in Japan have developed a gigahertz ultrasonic circuit that utilizes the principle of topology. This innovative development promises to revolutionize the design and performance of ultrasonic...

Sivers Semiconductors AB (Sivers), a  supplier of integrated chips and photonics modules for the most advanced communications and sensor solutions, appointed Vickram Vathulya as its new President & CEO, succeeding...

The U.S. Department of Commerce has announced a proposed investment of up to $400 million in direct funding under the CHIPS and Science Act to support GlobalWafers in constructing new...

The Department of Commerce and Natcast, operator of the National Semiconductor Technology Center (NSTC), have initiated the selection process for the first three R&D facilities funded by the CHIPS and...

SoftBank Group has acquired Graphcore, a UK-based start-up developing an Intelligence Processing Unit (IPU) platform designed for handling extremely large machine intelligence workloads. Graphcore’s latest Bow IPU leverages Wafer-on-Wafer (WoW)...

The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging in the United States. With up to $1.6 billion in...